2015
DOI: 10.1016/j.phpro.2015.09.094
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Technology for Fast Fabrication of Glass Microhotplates Based on the Laser Processing

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Cited by 5 publications
(5 citation statements)
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“…1(b). (20) The substrates were 30-μm-thick boron-silicate glass with transformation temperature T g = 720 ℃. 4"-Square size wafer was diced with a diamond saw into 4 pieces.…”
Section: Semiconductor Sensorsmentioning
confidence: 99%
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“…1(b). (20) The substrates were 30-μm-thick boron-silicate glass with transformation temperature T g = 720 ℃. 4"-Square size wafer was diced with a diamond saw into 4 pieces.…”
Section: Semiconductor Sensorsmentioning
confidence: 99%
“…(19) (b) Schematic diagram of heating element after laser processing. (20) (c) Diagram (with dimensions) of a sensor structure based on MEMS technology. (17) (a)…”
Section: Semiconductor Sensorsmentioning
confidence: 99%
See 2 more Smart Citations
“…Sensor of such type consists of the microhotplate responsible for level of power consumption and working temperature parameters, gas sensitive layer and the package. Today already developed a few approaches [1] for low power ceramic MEMS microhotplates made from membrane materials like ZrO2 [2], Al2O3 [3], LTCC [4], SiO2 [5] based on non-standard or clean room technologies. Opposite our approach with laser micro milling technology gives wide flexible possibilities to fabricate custom MEMS microhotplate platform and also packages for MOX sensor from monolithic ceramic materials, that gives complete solution for integration one in devices using IoT conception.…”
Section: Introductionmentioning
confidence: 99%