Tarnishing and Cu Ion release in Selected Copper-Base Alloys: Implications towards Antimicrobial Functionality

Horton, Derek J.; Ha, Hung M.; Foster, Leanna L.; Bindig, H.J.; Scully, John R.

doi:10.1016/j.electacta.2015.04.001

Cited by 40 publications

(32 citation statements)

References 64 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Air oxidized Cu-5Zn-5Al-1Sn contained a very small amount of a third species, which based on potential is attributed to either amorphous Zn(OH) 2 or Sn(OH) 2 , not previously detected by GIXRD, galvanostatic reduction, or Raman spectroscopy. 20 However, these species did not tangibly alter release rates.…”

Section: Summary Of Results and Findingsmentioning

confidence: 97%

“…Cu-5Zn-5Al-1Sn exhibits a slightly lower corrosion rate than Cu, confirmed by 30% less total mass loss compared to Cu over 130 h. There is stoichiometrically less copper to participate in the corrosion process, and Zn is known to reduce the overall corrosion rate; this result corresponds well to the previously observed behavior. [20][21] The OCP and ICP-OES tests suggest the initial dealloying of Zn occurred over the first 12 h at OCP and that negligible Al and Sn was detected. Equating mass loss to Q corr through Faraday's law yields an apparent oxidation number of 1.6 for Cu and 2.0 for Cu-5Zn-5Al-1Sn.…”

Section: Effect Of Zn Al and Sn Alloying Additions On Thin Oxides Amentioning

confidence: 99%

“…15 Cu-5Zn-5Al-1Sn contains both zinc (Zn) and aluminum (Al), which may suppress Cu ion release, and tin (Sn), which has been shown in Cu-Sn alloys to enhance Cu ion release in synthetic perspiration. 20 However, there is a lack of understanding concerning corrosion behavior of Cu-5Zn-5Al-1Sn with and without a thin air formed oxide. To establish a scientific understanding of the origins of the effect seen in antimicrobial studies and to establish whether the effect might still be observed on high touch surfaces, overall corrosion, oxide formation, and Cu ion release behavior on Cu-5Zn-5Al-1Sn must be compared to Cu.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

The Fate of Copper during Corrosion of Cu-5Zn-5Al-1Sn (89% Cu, 5% Zn, 5% Al, 1% Sn) compared to Copper in Synthetic Perspiration Solution

Foster¹,

Hutchison²,

Scully³

2015

Corrosion

View full text Add to dashboard Cite

Cu-5Zn-5Al-1Sn (89% Cu, 5% Zn, 5% Al, 1% Sn) and UNS C11000 copper (Cu) were compared with respect to corrosion rate, film formation, and Cu release in two surface conditions pertinent to the use of antimicrobial functional materials. Electrochemical, surface characterization, and solution analysis methods were utilized to track the fate of copper during corrosion in synthetic perspiration solution in a freshly ground condition and after 30-d lab air passivation. Corrosion behavior was a function of both alloy composition and surface condition with slightly lower corrosion rates on Cu-5Zn-5Al-1Sn compared to Cu. Throughout the corrosion process, the majority of Cu was observed to undergo dissolution into the synthetic perspiration solution as copper cations for both materials, at concentrations that would suggest favorable antimicrobial functionality for both Cu-5Zn-5Al-1Sn and Cu, regardless of surface condition. In contrast, oxide films were thinner on Cu-5Zn-5Al-1Sn under all conditions. Hence, the combination of a slightly lower corrosion rate and a thinner oxide resulted in a similar Cu release rate for the two materials in synthetic perspiration.

show abstract

Section: Summary Of Results and Findingsmentioning

confidence: 97%

Section: Effect Of Zn Al and Sn Alloying Additions On Thin Oxides Amentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

The Fate of Copper during Corrosion of Cu-5Zn-5Al-1Sn (89% Cu, 5% Zn, 5% Al, 1% Sn) compared to Copper in Synthetic Perspiration Solution

Foster¹,

Hutchison²,

Scully³

2015

Corrosion

View full text Add to dashboard Cite

show abstract

“…distance (time) between maxima in the first derivative plots of chronopotential curves according to procedures outlined in detail in previous work. 29,30,37 The thickness of the oxide can be roughly estimated through the calculation in Equation 4.…”

Section: Methodsmentioning

confidence: 99%

“…As a control study and to determine the valence of soluble Cu for the present and other work: stronger chelators such as citric acid (log ß = 5.8 vs. lactic acid: log ß = 2.7) have shown excellent quantified dose-response to galvanostatic anodic holds and measured ion release and oxide quantity via unacidified ICP. 9,29,30,[37][38][39] Emission intensities were compared with calibrated standards of known concentrations. LOD were found to be 17 and 198 ppb for Cu and Al, respectively.…”

Section: Methodsmentioning

confidence: 99%

Solute Capture and Doping of Al in Cu₂O: Corrosion, Tarnish Resistance, and Cation Release of High-Purity Cu-Al Alloys in Artificial Perspiration

Hutchison

Scully

2018

J. Electrochem. Soc.

View full text Add to dashboard Cite

Frequently-touched surfaces are a common transmission source for hospital and community acquired infections. Cu alloys have shown promise as antimicrobial surfaces, able to kill even antibiotic-resistant bacteria within minutes. However, the most efficacious alloy systems readily tarnish making them unsuitable for hospital applications and tarnish-resistant (e.g., passive) systems often cannot maintain sufficient Cu ion release to maintain antimicrobial function. An ideal alloy would have optimal corrosion, tarnishing, and Cu release tuned through alloying elements. Cu-Al alloys are tarnish-resistant, yet the precise role of Al remains unclear. Highpurity binary alloys of Cu-Al were fully immersed in artificial perspiration at open circuit to evaluate soluble cation release, quantity and identity of corrosion products, as well as interrogate the role of Al on the chemical, structural, and electronic defect structure of oxides formed. Al became captured in Cu 2 O as a substitutional cation defect which in turn caused structural, and electronic modifications. This doped film did not inhibit soluble Cu cation release for antimicrobial function even after 144 h. Al-doped cuprous oxide had fewer electronic charge carriers (holes) due to Al-doping and subsequent increased electronic resistance. These results are promising regarding the aim of generating a tunable tarnish-resistant layer for an antimicrobial Cu-based alloy.

show abstract

From Bulk to Nanoparticles: An Overview of Antiviral Materials, Its Mechanisms, and Applications

Rodrigues

Campo

Arns

et al. 2021

Part & Part Syst Charact

View full text Add to dashboard Cite

Infectious diseases caused by viruses are a global health concern and have become prominent in light of the recent COVID‐19 pandemic. Considering the limitations of drugs and prophylactic methods used in current medicine, antiviral materials are a useful strategy in preventing the spread of viruses and enhancing treatment efficiency. Thus, this review highlights the state‐of‐the‐art antiviral materials, describes the scientific landscape of the primary antiviral materials used based on bibliometric analysis, presents their mechanisms of action, and discusses their clinical applications. The mechanisms of action underlying the broad‐spectrum antiviral properties of metals, ceramics, polymers, and composites are also discussed. Polyanions, polycations, oxides, and metal‐based materials, from bulk to nanoparticles, have good potential in antiviral applications that may help prepare the world for future viral breakouts.

show abstract

Tarnishing and Cu Ion release in Selected Copper-Base Alloys: Implications towards Antimicrobial Functionality

Cited by 40 publications

References 64 publications

The Fate of Copper during Corrosion of Cu-5Zn-5Al-1Sn (89% Cu, 5% Zn, 5% Al, 1% Sn) compared to Copper in Synthetic Perspiration Solution

The Fate of Copper during Corrosion of Cu-5Zn-5Al-1Sn (89% Cu, 5% Zn, 5% Al, 1% Sn) compared to Copper in Synthetic Perspiration Solution

Solute Capture and Doping of Al in Cu₂O: Corrosion, Tarnish Resistance, and Cation Release of High-Purity Cu-Al Alloys in Artificial Perspiration

From Bulk to Nanoparticles: An Overview of Antiviral Materials, Its Mechanisms, and Applications

Contact Info

Product

Resources

About

Tarnishing and Cu Ion release in Selected Copper-Base Alloys: Implications towards Antimicrobial Functionality

Cited by 40 publications

References 64 publications

The Fate of Copper during Corrosion of Cu-5Zn-5Al-1Sn (89% Cu, 5% Zn, 5% Al, 1% Sn) compared to Copper in Synthetic Perspiration Solution

The Fate of Copper during Corrosion of Cu-5Zn-5Al-1Sn (89% Cu, 5% Zn, 5% Al, 1% Sn) compared to Copper in Synthetic Perspiration Solution

Solute Capture and Doping of Al in Cu2O: Corrosion, Tarnish Resistance, and Cation Release of High-Purity Cu-Al Alloys in Artificial Perspiration

From Bulk to Nanoparticles: An Overview of Antiviral Materials, Its Mechanisms, and Applications

Contact Info

Product

Resources

About

Solute Capture and Doping of Al in Cu₂O: Corrosion, Tarnish Resistance, and Cation Release of High-Purity Cu-Al Alloys in Artificial Perspiration