Tacky cyclic olefin copolymer: a biocompatible bonding technique for the fabrication of microfluidic channels in COC

Keller, Nico; Nargang, Tobias M.; Runck, Matthias; Kotz, Frederik; Striegel, Andreas; Sachsenheimer, Kai; Klemm, Denis; Länge, Kerstin; Worgull, Matthias; Richter, Christiane; Helmer, Dorothea; Rapp, Bastian E.

doi:10.1039/c5lc01498k

Cited by 37 publications

(33 citation statements)

References 21 publications

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“…[4][5][6] Thermoplastics, on the other hand, are often sealed by applying pressure and temperature either above their glass transition temperature (T g ) by thermal bonding or below T g by a solvent assisted approach, 7,8 although recently the possibility of bonding cyclic olefin copolymer (COC) by applying pressure at room temperature has been reported with the right mixture of solvents. 9 These approaches require a delicate tuning to avoid the deformation of the initial structures, especially if they are small or present a high aspect ratio. Then, glass to glass bonding requires chemical procedures at high temperature 10 or highly corrosive acids.…”

Section: Introductionmentioning

confidence: 99%

A simple and low-cost chip bonding solution for high pressure, high temperature and biological applications

et al. 2017

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Section: Introductionmentioning

confidence: 99%

A simple and low-cost chip bonding solution for high pressure, high temperature and biological applications

et al. 2017

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“…This is the method of choice because this process does not introduce foreign chemical species (e.g. adhesive layers and reactive glues) and the solvent is completely evaporated during drying of the biochip assemblies 27 . Two particular polymers of interest are cyclic olefins including Topas ® (COC) and Zeonor ® (COP) because of high optical transparency, good solvent stability and high mechanical stability.…”

Section: Assessment Of Bonding Strategies For Biocompatible Microfluimentioning

confidence: 99%

A compression transmission device for the evaluation of bonding strength of biocompatible microfluidic and biochip materials and systems

Kratz

Bachmann

Spitz

et al. 2020

Sci Rep

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Bonding of a variety of inorganic and organic polymers as multi-layered structures is one of the main challenges for biochip production even to date, since the chemical nature of these materials often does not allow easy and straight forward bonding and proper sealing. After selection of an appropriate method to bond the chosen materials to form a complex biochip, function and stability of bonding either requires qualitative burst tests or expensive mechanical multi-test stations, that often do not have the right adaptors to clamp biochip slides without destruction. Therefore, we have developed a simple and inexpensive bonding test based on 3D printed transmission elements that translate compressive forces via manual compression, hand press or hydraulic press compression into shear and tensile force. Mechanical stress simulations showed that design of the bonding geometry and size must be considered for bonding tests since the stress distribution thus bonding strength heavily varies with size but also with geometry. We demonstrate the broad applicability of our 3D printed bonding test system by testing the most frequent bonding strategies in combination with the respective most frequently used biochip material in a force-to-failure study. All evaluated materials are biocompatible and used in cell-based biochip devices. This study is evaluating state-of-the-art bonding approaches used for sealing of microfluidic biochips including adhesive bonding, plasma bonding, solvent bonding as well as bonding mediated by amino-silane monolayers or even functional thiol-ene epoxy biochip materials that obviate intermediate adhesive layers.

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“…Solutions such as oxygen plasma or UV treatment of COC and direct deposition of gold (Au) resonators on COC have been proposed . Exposing or immersing COC to a mixture of a polar solvent, such as acetone or a nonpolar solvent, such as cyclohexane, has also been proposed for biochemical applications where heat or plasma treatment is not favored . However, these techniques are not suitable for multilayer devices that involve multiple patterning steps.…”

Section: Fabrication Of Single and Multilayer Terahertz Metasurface Dmentioning

confidence: 99%

Dielectrics for Terahertz Metasurfaces: Material Selection and Fabrication Techniques

Ako

Upadhyay

Withayachumnankul

et al. 2019

Advanced Optical Materials

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on distinctive spectral signatures resulting from vibrational modes of covalent and hydrogen bonds. [8,[13][14][15][16] The focus on this spectrally rich region is attributed to the highly coherent and nonionizing nature of terahertz radiation, wide unallocated frequency bands, distinctive wavelengths, and their penetration through a significant depth of dielectric materials. Terahertz technology is geared toward realizing devices that can efficiently manipulate the phase, amplitude, and polarization of terahertz radiations for the above-mentioned myriad of applications.However, progress in this domain is held back by low terahertz power available from compact sources, high free-space path loss, and limited choice of materials that exhibit less absorption of terahertz waves. [17] Owing to the fact that natural materials demonstrate weak wave-matter interaction at terahertz frequencies, terahertz devices with engineered subwavelength resonant metallic inclusions on dielectric spacers have been realized, to interact strongly with an incident electromagnetic wave.In the past, metamaterials have been a promising route to building terahertz devices. These devices have in essence been engineered as 3D resonating elements that effectively manipulate both permittivity and permeability of an effective medium to couple to free space. The underlining disadvantage of these structures is the difficulty involved in the fabrication of 3D geometrical structures using standard semiconductor fabrication techniques. Standard fabrication techniques are generally amenable to 2D design with extrusion of these structures into thickness (the third, vertical dimension). Moreover, the choice and availability of dielectric materials and metals that provide sufficient interaction while retaining device efficiency has proved challenging. [13,[18][19][20] Recently, effective manipulation of electromagnetic wave has been widely demonstrated with 2D metasurfaces, which were originally employed as building blocks for 3D metamaterials. In these lower-dimension designs, effective manipulation of terahertz waves for various applications is achieved by carefully designing sub-wavelength resonant structures as is evident in published review articles. [21,22] Metasurfaces present high degree of compactness that enhances radiation efficiency. Additionally, the planar form factor of metasurfaces enables Manipulation of terahertz radiation opens new opportunities that underpin application areas in communication, security, material sensing, and characterization. Metasurfaces employed for terahertz manipulation of phase, amplitude, or polarization of terahertz waves have limitations in radiation efficiency which is attributed to losses in the materials constituting the devices. Metallic resonators-based terahertz devices suffer from high ohmic losses, while dielectric substrates and spacers with high relative permittivity and loss tangent also reduce bandwidth and efficiency. To overcome these issues, a proper choice of low loss and low relative permittivi...

show abstract

Tacky cyclic olefin copolymer: a biocompatible bonding technique for the fabrication of microfluidic channels in COC

Cited by 37 publications

References 21 publications

A simple and low-cost chip bonding solution for high pressure, high temperature and biological applications

A simple and low-cost chip bonding solution for high pressure, high temperature and biological applications

A compression transmission device for the evaluation of bonding strength of biocompatible microfluidic and biochip materials and systems

Dielectrics for Terahertz Metasurfaces: Material Selection and Fabrication Techniques

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