Synthesis and characterization of ceramic nanoparticles reinforced lead-free solder

Abstract

Sn-0.7Cu is among the least expensive types of lead-free solders available. However, its poor mechanical properties have limited its application. In this study, Sn-Cu lead-free solder reinforced with amorphous silica (SiO 2) nanoparticles was synthesized through powder metallurgy route. Desired mixtures of raw materials was mechanically milled, compressed, sintered and extruded to prepare bulk solder samples. The samples were characterized by optical and electron microscopy as well as mechanical tests. The results showed that mechanical properties were increased by addition of SiO 2 nanoparticles to the solder matrix. Addition of 1.5wt.% ceramic reinforcement to the composite increased tensile, yield and compressive strengths up to 27, 23 and 41 percent, respectively, compared to those of the monolithic sample. In addition, the ceramic nanoparticles caused an up to 50% decrease in the wetting angle between the substrate and the nanocomposite solder.

Effect Of 3% Molybdenum (Mo) Nanoparticles on The Melting, Microstructure and Hardness Properties of As- Reflowed Low Mass Sn-58Bi (SB) Solder Alloy

“…Ani et al, [11] also provided similar observation with the additions of TiO2 in the SnAgCu solder alloy. In another study, SiO2 nanoparticles were added to Sn0.7Cu solder alloy where there was an increment in tensile stress (43.4MPa) for 1.5wt% additions which was 25% higher than the bare Sn0.7Cu [26]. At the same time, a detrimental in tensile strength was observed with a higher concentration of SiO2 of more than 1.5wt%.…”

Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching

“…The trend of incorporating non-reacting ceramics reinforcement materials has risen rapidly in current developments of the SAC305. The effect of reinforcement materials (mainly nanoparticles) such as NiO [1], TiO 2 [4], graphene and TiO 2 [5] and SiO 2 [6] were investigated as an improved version of the SAC305 composite solder. For example, the addition of 2.5 wt% NiO nanoparticles in SAC305 solder alloys decreased the IMC layer formation of 50% and increased the microhardness of the solder joints [1].…”

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

“…Due to excellent physicochemical properties and size effects, nanoparticles play a significant role in refining grains, increasing mechanical properties, and improving wettability of lead-free solder [14][15][16][17][18][19]. Therefore, more and more researchers are focused on the preparation and performance characterization of the composite solders reinforced by various nanoparticles.…”