Surface Tension and Its Temperature Coefficient of Molten Tin Determined with the Sessile Drop Method at Different Oxygen Partial Pressures

Yuan, Zhangfu; Mukai, Kusuhiro; Takagi, Katsuhiko; Ohtaka, Masahiko; Huang, Wen; Liu, Qiu Sheng

doi:10.1006/jcis.2002.8589

Cited by 81 publications

(48 citation statements)

References 26 publications

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“…Contact angle was measured by using a sessile drop equipment, which is composed of a heating systems, imaging systems and graphics computing systems. [8][9][10][11][12] The slag specimen was polished to mirror, rinsed in ethanol by an ultrasonic cleaner and dried afterward, while the carbon bricks were prepared by the same steps and then dried in a muffle furnace to remove the gases and impurities.…”

Section: Methodsmentioning

confidence: 99%

Wettability between Molten Slag and MgO–C Refractories for the Slag Splashing Process

Yuan

Zhao

et al. 2013

ISIJ Int.

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Wetting experiments in two cases have been carried out to measure the wettability between molten slag and MgO-C refractories. Especially, the variations of wettability with time are taken into consideration in this paper. The spread diameter increased significantly and the slag height decreased with the increase of the time from 0 to 237 s at 1 783 K. While the spread diameter changed slowly, and reached the steady state from 300 to 500 s. More specifically, the fitting formulae for diameter, height, area of the slag as a function of time have been determined. Moreover, the interfacial characteristics of the non-melting slag and MgO-C refractories and of the wetting slag and MgO-C refractories were investigated to further explain the wettability in two cases.With the help of the wetting experiment, adhesion and protection mechanism was demonstrated. It could optimize the slag splashing process and give guides to the increase of the converter lining life, which can make the contribution to the promotion of technological transformation and innovation of the steel industry.

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Section: Methodsmentioning

confidence: 99%

Wettability between Molten Slag and MgO–C Refractories for the Slag Splashing Process

Yuan

Zhao

et al. 2013

ISIJ Int.

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“…Wetting experiments were performed by the sessile drop method in an Ar (99.999%)-H 2 (99.999%) flow, which has been described in more detail elsewhere [12,13]. The heat-ing rate was 20-30 K/min.…”

Section: Methodsmentioning

confidence: 99%

“…Both the alloys and the substrates were polished with SiC paper with an abrasive number of up to 2000 and then cleaned ultrasonically. Wetting experiments were performed by the sessile drop method in an Ar (99.999%)-H 2 (99.999%) flow, which has been described in more detail elsewhere [12,13]. The heat-…”

mentioning

confidence: 99%

Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate

et al. 2011

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The reactive wetting kinetics of a Sn-30Bi-0.5Cu Pb-free solder alloy on a Cu substrate was investigated by the sessile drop method from 493 to 623 K. The triple line frontier, characterized by the drop base radius R was recorded dynamically with a high resolution CCD using different spreading processes in an Ar-H 2 flow. We found a good agreement with the De Gennes model for the relationship between ln(dR/dt) and lnR for the spreading processes at 493 and 523 K. However, a significant deviation from the De Gennes model was found for the spreading processes at 548 and 623 K. Our experimental results show a complicated temperature effect on the spreading kinetics. Intermetallics at the Sn-30Bi-0.5Cu/Cu interface were identified as Cu 6 Sn 5 adjacent to the solder and Cu 3 Sn adjacent to the Cu substrate. The intermetallic compounds effectively enhanced the triple line mobility because of reaction product formation at the diffusion frontier. In response to concerns over Pb, extensive investigations have been carried out over the last few years to find an acceptable Pb-free solder for various electronic attachment applications. A large number of Pb-free solder alloys have been proposed. The wetting of a solid by a melt and the subsequent interfacial reactions are essentially involved in a large number of processes such as coating and soldering [1][2][3][4][5]. Studying wetting behavior is important in the characterization of solder alloys and it provides basic physicochemical data for the design and development of composite lead-free solder alloys [6][7][8][9][10][11]. However, systematic investigations into the wetting process of the ternary Sn-30Bi-0.5Cu lead-free solder alloy on different substrates are scarce. Cu is one of the most common substrates used in microelectronic devices. Therefore, the general objective of this work is to better understand the wetting process of the Sn30Bi-0.5Cu/Cu system. Materials and methodsSn-30Bi-0.5Cu (wt.%) alloy was prepared by induction melting the alloy powders in a medium-frequency induction furnace (WK-II, Beijing Wuke Photoelectric Technique Co., Ltd., Beijing, China) under an Ar (99.999%) atmosphere followed by casting into copper molds. The alloys were stirred in a quartz crucible for at least 15 min to obtain a homogeneous structure and composition before casting. The sample alloy with an approximate height of 4 mm was used for the wetting experiment and was cut from the as-cast rod that had a diameter of 5 mm. The oxygen-free Cu substrate that was used in the wetting process was cut into 20 mm × 20 mm × 2 mm pieces. Both the alloys and the substrates were polished with SiC paper with an abrasive number of up to 2000 and then cleaned ultrasonically. Wetting experiments were performed by the sessile drop method in an Ar (99.999%)-H 2 (99.999%) flow, which has been described in more detail elsewhere [12,13]. The heat-

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“…Suplicz and Kovács [22] developed thermally conductive polymer/LMTM composites which can be processed easily with injection molding. However, the extremely low viscosity and ultrahigh surface tension of liquid metal compared with polymer melt [6,[24][25][26] would lead to serious agglomeration of LMTM. Thus the content and the dispersion of LMTM in polymer matrix would be severely restricted [27].…”

Section: Y C Jia H He * P Yu J Chen X L Laimentioning

confidence: 99%

“…When the Sn content is 20 wt% (3.79 vol%) the agglomerate size reaches about 70 μm. This is mainly ascribed to the extremely low viscosity (1.4-1.8 mPa·s during 500-600 K) [6] and ultrahigh surface tension (400-620 mN/m during 400-1600 K) [22] for liquid metal versus the high viscosity (about 100 Pa·s during shear rate of 100-1000/s) [24] and low surface tension (lower than 40 mN/m at 230 °C ) [23] for polymer melt, which leads to poor compatibility between PA6 and Sn. The fact that Sn has good flowability and a strong trend of shrinking superficial area in the state of liquid leads to serious agglomeration in the PA6 matrix.…”

Section: Thermal Stability Of the Compositesmentioning

confidence: 99%

Synergistically improved thermal conductivity of polyamide-6 with low melting temperature metal and graphite

Jia¹,

He²,

Yu³

et al. 2016

Express Polym. Lett.

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Abstract. Low melting temperature metal (LMTM)-tin (Sn) was introduced into polyamide-6 (PA6) and PA6/graphite composites respectively to improve the thermal conductivity of PA6 by melt processing (extruding and injection molding). After introducing Sn, the thermal conductivity of PA6/Sn was nearly constant because of the serious agglomeration of Sn. However, when 20 wt% (5.4 vol%) of Sn was added into PA6 containing 50 wt% (33.3 vol%) of graphite, the thermal conductivity of the composite was dramatically increased to 5.364 versus 1.852 W·(m·K) -1 for the PA6/graphite composite, which suggests that the incorporation of graphite and Sn have a significant synergistic effect on the thermal conductivity improvement of PA6. What is more, the electrical conductivity of the composite increased nearly 8 orders of magnitudes after introducing both graphite and Sn. Characterization of microstructure and energy dispersive spectrum analysis (EDS) indicates that the dispersion of Sn in PA6/graphite/Sn was much more uniform than that of PA6/Sn composite. According to Differential Scanning Calorimetry measurement and EDS, the uniform dispersion of Sn in PA6/graphite/Sn and the high thermal conductivity of PA6/graphite/Sn are speculated to be related with the electron transfer between graphite and Sn, which makes Sn distribute evenly around the graphite layers.

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Surface Tension and Its Temperature Coefficient of Molten Tin Determined with the Sessile Drop Method at Different Oxygen Partial Pressures

Cited by 81 publications

References 26 publications

Wettability between Molten Slag and MgO–C Refractories for the Slag Splashing Process

Wettability between Molten Slag and MgO–C Refractories for the Slag Splashing Process

Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate

Synergistically improved thermal conductivity of polyamide-6 with low melting temperature metal and graphite

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