The lateral wet oxidation of strained AlAsSb was studied. AlAs 0.80 Sb 0.20 interlayers were grown on a GaAs substrate and capped with a lattice-matched In 0.25 Ga 0.75 As layer. The AlAsSb was oxidized between 350 and 450°C. Oxidation temperatures Ͼ400°C resulted in poor surface morphology and delamination. Oxidation of thicker AlAsSb interlayers (hϷ2000 Å) resulted in metallic Sb layers forming between the AlO x and the semiconductor interfaces. The remaining Sb metal at the oxidesemiconductor interface was ϳ15% oxidized. Lateral wet oxidation of thinner AlAsSb interlayers (hр500 Å) resulted in Sb inclusions at the oxide-semiconductor interface. The Sb inclusions were 1.5-2.0 m in diameter and the inclusion thickness was approximately equal to the AlAsSb layer thickness. Methanol (CH 3 OH) was added to the water mixture with the intent to stabilize the otherwise unstable stibine (SbH 3 ) such that Sb could be removed from the oxidizing structure. However, methanol addition resulted in a decreased oxidation rate and a change in the Sb precipitate morphology. The Sb inclusions observed in pure water oxidation changed to a Sb finger-like morphology with increasing methanol concentration. The Sb fingers were 1.0-2.0 m wide and as long as the oxidation depth. Oxidation of AlAsSb interlayers hр200 Å were limited by the incorporation of Ga from the substrate and capping layer into the oxidation layer. Doping the oxidation AlAsSb interlayer 1ϫ10 18 cm Ϫ3 n type ͑Si or Te͒ did not result in any improvement in Sb segregation.