“…11,12 Its thermal conduction can be boosted by controlling its loading amount, pH value, size, shape, viscosity, and dispersion, or by incorporating TiO 2 with other materials (Cu, Pt, SiO 2 , Al 2 O 3 , CuO, Er 2 O 3 , ZrO 2 , Cu 2 Se, SiC, and C). 11–20 Nevertheless, the current TiO 2 and its composites utilized as thermal-conductive fillers have high loading (52–100%) and low TC (0.122–2.78 W (m K) −1 ) and thus are unsuitable for practical application. 13–20…”