KEM 2009 DOI: 10.4028/ View full text
Ke Hua Zhang, Dong Hui Wen, Ju Long Yuan

Abstract: Dual-lapping was a process to planarize the surface of the sapphire wafer, the nature of surface&subsurface damage and the surface uniformity was depended on the material removal mode and materials removal ratio. Material removal mode was studied in this paper, and the model of material removal was set up too. The SEM was used to scan the processed sapphire surface and the different removal style (two body and three body) were discovered. This research provided valuable insights into the material removal r…

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