Study on impacts of configuration parameters on flip stacked Au bumps stress and strain under random vibration load

Liangbin, Shao; Huang, Chunyue; Li, Tianming; Liang, Ying Chun; Xingjin, Zhou

doi:10.1109/icept.2015.7236657

Cited by 2 publications

(1 citation statement)

References 7 publications

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“…They found that PBGA modules mounted on a PCB increase the stiffness of the PCB. Liang et al [7] performed orthogonal experiment to study the impact of configuration parameters on PBGA lead-free solder joints stress and strain under random vibration load. Cui et al [8] conducted random vibration analysis of PBGA solder joints with different parameters and found out the maximum stress of PBGA solder joints occurs at the corners of solder joint array and at the points close to the PCB.…”

Section: Introductionmentioning

confidence: 99%

Optimal design of PBGA mixed solder joints under random vibration

Lü

Zhou

Pan

et al. 2014

2014 10th International Conference on Reliability, Maintainability and Safety (ICRMS)

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This article provides a method to perform finite element analysis (FEA) and theoretical analysis on stress and strain characteristics of plastic ball grid array (PBGA) assembly under the random vibration environment. For the mixed solder joints, ball diameter, ball pitch and ball array were selected as three critical parameters. By using a L 9 (3 4 ) orthogonal matrix, the mixed solder joints of PBGA components which have nine different technology parameter combinations were designed. In order to investigate the distribution of stress and strain of mixed solder joints, random vibration simulation for the PBGA assembles was simulated. Based on the stress value, range analysis was researched. The results indicate that the maximum stress of PBGA occurs at the outside corner of solder joints matrix and concentrates on the interface between the solder ball and pad near the PCB. In this study, the stress of mixed solder joints is affected by solder ball array, ball pitch, ball diameter in a descending order, and the maximum stress of the mixed solder joints is inversely proportional to all of them. The results lay a basis for high reliability design of PBGA assembly for engineering application.

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Section: Introductionmentioning

confidence: 99%