DOI: 10.4028/www.scientific.net/kem.416.529
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Ren Ke Kang, Shang Gao, Zhu Ji Jin, Dong Ming Guo

Abstract: With the development of IC manufacturing technology, the machining precision and surface quality of silicon wafer are proposed much higher, but now the planarization techniques of silicon wafer using free abrasive and bonded abrasive have the disadvantage of poor profile accuracy, environmental pollution, deep damage layer, etc. A soft abrasive wheel combining chemical and medical effect was developed in this paper, it could get super smooth, low damage wafer surface by utilizing mechanical friction of abrasiv…

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