Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamics simulation

Cai, M.B.; Li, X.P.; Rahman, M.

doi:10.1016/j.ijmachtools.2006.02.016

Cited by 140 publications

(61 citation statements)

References 22 publications

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“…It is ideal to model both the work material and cutting tool as deformable bodies to facilitate their tribological interaction. The model uses negative tool rake angle [30,81] and also should have a finite tool edge radius [42,78,[82][83][84] as it is considered suitable for cutting of brittle materials. MD simulation is becoming a widely used studying method to understand the material deformation mechanisms rapidly.…”

Section: Molecular Dynamic Simulationmentioning

confidence: 99%

A review on ductile mode cutting of brittle materials

2018

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Brittle materials have been widely employed for industrial applications due to their excellent mechanical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming. Ductile mode cutting is a very promising way to achieve high quality and crack-free surfaces of brittle materials. Thus the study of ductile mode cutting of brittle materials has been attracting more and more efforts. This paper provides an overview of ductile mode cutting of brittle materials including ductile nature and plasticity of brittle materials, cutting mechanism, cutting characteristics, molecular dynamic simulation, critical undeformed chip thickness, brittle-ductile transition, subsurface damage, as well as a detailed discussion of ductile mode cutting enhancement. It is believed that ductile mode cutting of brittle materials could be achieved when both crack-free and no subsurface damage are obtained simultaneously.

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Section: Molecular Dynamic Simulationmentioning

confidence: 99%

A review on ductile mode cutting of brittle materials

2018

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“…De forma general se puede expresar la ecuación (9) así: ℎ = ℎ − (11) En donde representa el parámetro de forma del indentador; de esta manera se tiene que: Para calcular la dureza se debe considerar el área de contacto que viene dada por:…”

Section: Cálculo De La Durezaunclassified

Interfaz gráfica de usuario para la simulación por dinámica molecular de películas delgadas

Barco-Ríos

Aristizábal-Soto

2016

TecnoL.

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En este trabajo se implementó el software de simulación para la nanoindentación de películas delgadas. El software desarrollado empleó la técnica de Dinámica Molecular. El modelo con el cual opera la interfaz gráfica (software), es un modelo aproximado, que reproduce las tendencias de las curvas características en pruebas de dureza de materiales. Por otro lado, el programa se diseñó y construyó con un entorno amigable, donde el usuario puede construir sus propias películas delgadas, tanto en monocapas como en bicapas. La interfaz permite controlar el espesor de la película, el número de capas y otras propiedades físicas tales como energía de disociación o parámetros de energía en la esfera; además, se puede tener control de los pasos de tiempo de dinámica. Para comprobar el funcionamiento del software se realizaron una serie de simulaciones utilizando los parámetros del cromo como material de referencia. Los resultados obtenidos, demostraron que el software puede reproducir las tendencias y curvas características en pruebas de dureza de materiales. Se espera mejorar este software para que sea una herramienta que permita realizar comparaciones con futuras investigaciones experimentales.

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“…Deformation processes in real-life machining are more complex and require the use of a comprehensive modelling framework in analysing the cutting forces and stresses involved. Some researchers used molecular dynamic (MD) simulation to study the chip-removal mechanism [10][11][12] but his approach requires significant computational power in order to model a cutting process in physically meaningful volumes. Therefore, many MD simulations were applied in two-dimensional formulations for a small workpiece with unrealistically high cutting speeds.…”

Section: Introductionmentioning

confidence: 99%

“…Selecting materials for single-crystal machining studies, mainly copper and aluminium have been preferred in the literature [3][4][5][6][7][8][9][10][11][12]. In this paper a welldeveloped computational FE/SPH model was applied for these two monocrystalline materials to fully understanding the variation of cutting forces.…”

Section: Introductionmentioning

confidence: 99%

Variation of cutting forces in machining of f.c.c. single crystals

2015

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In this study, micro-machining of f.c.c single-crystal materials was investigated based on a hybrid modelling approach combining smoothed particle hydrodynamics and continuum finite element analysis. The numerical modelling was implemented in a commercial software ABAQUS/Explicit by employing a user-defined subroutine VUMAT for a crystal-plasticity formulation to gain insight into the underlying mechanisms that drive a plastic response of materials in highdeformation processes. The numerical studies demonstrate that cutting-force variations in different cutting directions are similar for different f.c.c. crystals even though the magnitudes of the cutting forces are different.

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Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamics simulation

Cited by 140 publications

References 22 publications

A review on ductile mode cutting of brittle materials

A review on ductile mode cutting of brittle materials

Interfaz gráfica de usuario para la simulación por dinámica molecular de películas delgadas

Variation of cutting forces in machining of f.c.c. single crystals

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