Study of Package-on-Package solder joints under random vibration load based on Patran

Zhang, Long; Huang, Chunyue; Huang, Wei; Li, Tianming; Hua, Jianmin

doi:10.1109/icept.2016.7583172

Cited by 3 publications

(2 citation statements)

References 2 publications

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“…Values fall at or near 0 when there is no flowering overlap and close to or at 1 for near or complete overlap. We calculated SI in the R package spaa with the command niche.overlap() and method “schoener” [52].…”

Section: Methodsmentioning

confidence: 99%

Phylogenetic diversity of flowering plants declines throughout the growing season across a subalpine elevational gradient

Veldhuisen,

Enquist,

Dlugosch

2023

Preprint

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Co-flowering is a potential facilitative mechanism for plants to overcome pollinator declines and phenological mismatches by attracting more pollinators to a multi-species patch. Due to associated competition, facilitation is expected to be more beneficial among more distantly related plants that compete less, and more prevalent in stressful conditions where benefits outweigh potential costs. We test a novel set of predictions that follow from these hypotheses, including that modules of co-flowering species in montane plant communities will be associated with i) increased fitness, ii) phylogenetic overdispersion, and ii) higher elevations. We quantified flowering phenology and fitness of plants across an elevational gradient in the Colorado Rocky Mountains, identified co-flowering modules using a network approach, and analyzed the phylogenetic distribution of co-flowering modules. We found that fitness correlated positively with co-flowering across elevations, but the correlation was strongest at high-elevation sites. Phylogenetic dispersion increased with elevation but declined throughout the growing season. Late-season modules were more underdispersed at all elevations than early-season modules. By combining analyses of phenological timing, network structure, environmental stress, fitness, and phylogenetic patterns, our results reveal that plant communities may lose phylogenetic diversity as conditions become hotter and drier and climate change alters flowering phenology and pollination networks.

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Section: Methodsmentioning

confidence: 99%

Phylogenetic diversity of flowering plants declines throughout the growing season across a subalpine elevational gradient

Veldhuisen,

Enquist,

Dlugosch

2023

Preprint

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show abstract

“…Papers [15][16] show that the angle of the vibration is important and shearing stress for microelectronic packaging is the most for the electronic boards placed perpendicular to the surface that experiences the greatest amount of the stress at the soldered points. The work in [17][18] compares the different materials for the solders and concludes that the SAC387 experiences the maximum amount of the peeling stress for the microelectronic packaging under the dynamic loadings.…”

Section: Introductionmentioning

confidence: 99%

Analysis of Multilayered Power Module Packaging Behavior Under Random Vibrations

Liang

Ghaderi

et al. 2020

IEEE Trans. Compon., Packag. Manufact. Technol.

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Solder joints, are the critical components of the printed circuit boards (PCBs) in the moving electronic systems like satellites and automotive industries that are most vulnerable to accidental vibrations. So, the reliability of these boards since they are designed to be used for long-time applications is important. Since the laboratory tests are time-consuming and require wellequipped and costly measurement devices, reliability tests are preferred to perform through the analytical methods. In this study, an analytical model based on the multilayer-plate theory is presented for the random vibration analysis and results are obtained for the different vibration frequencies including the natural vibration frequency. For the proposed model, the state of the PCB layer and the amount of the stress in the solder joints are investigated separately and the normal and shear stresses are obtained through the combined sinusoidal-exponential equation. Results by the Finite Element Method (FEM) analysis show that the cracks form at the edge of the interconnection points of the board, and the solder and void formation and crack propagation appear in the corners of the PCB in frequencies closed to the natural vibration frequency. Reliability increases by the reduced solder height.

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Enhanced Reliability of a RF-SiP with Mold Encapsulation and EMI Shielding

Liu

Chien

Tseng

et al. 2019

2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

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Study of Package-on-Package solder joints under random vibration load based on Patran

Cited by 3 publications

References 2 publications

Phylogenetic diversity of flowering plants declines throughout the growing season across a subalpine elevational gradient

Phylogenetic diversity of flowering plants declines throughout the growing season across a subalpine elevational gradient

Analysis of Multilayered Power Module Packaging Behavior Under Random Vibrations

Enhanced Reliability of a RF-SiP with Mold Encapsulation and EMI Shielding

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