Solute diffusion in liquid metals

Measurement of diffusion coefficients of Au in liquid Ag with the shear cell technique

“…However, as far as authors know, a measurement of diffusion in these liquid systems has been performed only by Gupta [13] by using the long capillary method. He [13] reported diffusion coefficients in liquid Ag-Au alloys in the temperature range between 1253 K and 1533 K. The diffusion coefficients of the present study are slightly lower than Gupta's data.…”

“…However, as far as authors know, a measurement of diffusion in these liquid systems has been performed only by Gupta [13] by using the long capillary method. He [13] reported diffusion coefficients in liquid Ag-Au alloys in the temperature range between 1253 K and 1533 K. The diffusion coefficients of the present study are slightly lower than Gupta's data. The cause of experimental errors in the long capillary method, that is the undesirable contribution of diffusion on heating and cooling process and the segregation on solidification, may tend to increase slightly his measured diffusion coefficient.…”

Interdiffusion of Copper and Iron in Liquid Aluminum

“…[1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19] From these models, the temperature dependence of the diffusion coefficient has been given variously as T À5/2 , T 1/2 , T, T 3/2 , T 2 , exp(ÀQ 1 /RT), T 1/2 exp(ÀQ 2 /RT), T exp(ÀQ 3 /RT), and T 2 exp(ÀQ 4 /RT). Several of these theories [1,2,6,13,14,[16][17][18] have been extended to include solute diffusion as well. One of the factors hindering the development of a more inclusive theory for liquid diffusion is the sparcity of reliable experimental results.…”

Effects of Ni addition on the interfacial reactions between Sn–Cu solders and Ni substrate

“…According to the stream-line pattern, it is suggested that at the interface one solder layer exists that is the Cu source for the formation of Cu 6 Sn 5 . The diffusivity of Cu in liquid Sn at 250 C is 3.1 Â 10 À9 m 2 /s [25]. We can estimate that the diffusion distance in a spreading time of 5 s is 125 mm, and therefore the solder layer is approximately 125 mm.…”