IEEE Trans. Comp. Packag. Technol.
 2009
DOI: 10.1109/tcapt.2008.2007653
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Silicon-on-Organic Integration of a 2.4–GHz VCO Using High-Q Copper Inductors and Solder-Bumped Flip Chip Technology

Xuexi Huo
1
,
Guowei Xiao
2
,
P.C.H. Chan
3
et al.
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