2015
DOI: 10.1109/tcad.2015.2399439
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Abstract: Self-aligned double patterning (SADP) is being considered for use at the 10-nm technology node and below for routing layers with pitches down to ∼50 nm because it has better line edge roughness and overlay control compared to other multiple patterning candidates. To date, most of the SADPrelated literature has focused on enabling SADP-legal routing in physical design tools while few attempts have been made to address the impact SADP routing has on local, standard cell (SC) I/O pin access. At the same time, via… Show more

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Cited by 46 publications
(39 citation statements)
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“…Suppose the M2 pitch is 48 nm for 10 nm technology node, the minimum pitch of mandrel layout in Fig. 2 (b) is 96 nm, which is within the resolution limits of 193 nm lithography tools [63]. During the manufacturing process, the mandrel layout is first patterned with 193 nm lithography tools.…”
Section: Unidirectional Layoutmentioning
confidence: 99%
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“…Suppose the M2 pitch is 48 nm for 10 nm technology node, the minimum pitch of mandrel layout in Fig. 2 (b) is 96 nm, which is within the resolution limits of 193 nm lithography tools [63]. During the manufacturing process, the mandrel layout is first patterned with 193 nm lithography tools.…”
Section: Unidirectional Layoutmentioning
confidence: 99%
“…Practical manufacturing solutions could be much more complex and foundry dependent [24], [44]. However, unidirectional layout style with complex metal line-end and via design constraints remains a promising candidate for geometric scaling in advanced technology nodes, which also makes the [40], [64], (b) self-aligned via groups [3], [53]. unidirectional routing closure on lower metal layers extremely challenging.…”
Section: Advanced Manufacturing Constraintsmentioning
confidence: 99%
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“…This is very useful in realizing the three dimensional structure for Fin-Shaped Field Effect Transistor devices. Owing to its larger set of design restrictions there have been several studies done to manage layout for SADP implementation [26][27][28][29]. The more emphasis on layout regularity may impact the total area and timing realization for a certain layer.…”
Section: Double Patterning Techniquesmentioning
confidence: 99%