Selective metallization on glass surface by laser direct writing combined with supersonic particle deposition

Jo, Seunghwan; Akin, Semih; Park, Min Soo; Jun, Martin B. G.

doi:10.1016/j.mfglet.2021.07.009

Cited by 10 publications

(4 citation statements)

References 15 publications

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“…ED was chosen owing to its industrial applicability, eco-friendliness, effective thickness control, high selectivity, high deposition rate, high process throughput, and low cost of materials . The Cu plating bath was prepared by following the recipe described in refs and . The composition of the plating bath, with regard to the description, is presented in Table .…”

Section: Methodsmentioning

confidence: 99%

Selective Surface Metallization of 3D-Printed Polymers by Cold-Spray-Assisted Electroless Deposition

Akin,

Nath,

Jun

2023

ACS Appl. Electron. Mater.

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Selective surface metallization of insulating polymers is of particular interest in smart films, energy harvesting, and sensing applications. However, traditional polymer metallization techniques face challenges due to the need for environmentally hazardous pretreatment (e.g., strong acid etching) and costintensive palladium seeding processes, thereby limiting the largescale deployment of metallized polymers. With the advent of rapid prototyping, metallization on additively manufactured polymers drew attention in a variety of technological applications, as it enables the fabrication of low-cost electronic devices. In the current work, we deploy and evaluate a hybrid additive metallization route that can enable the fabrication of functional selective metallization on 3D-printed polymers in a rapid and eco-friendly methodology with improved electrical conductivity. The metallization route sequentially comprises (1) material extrusion 3D printing, (2) cold spray metallization, and (3) electroless deposition. The resulting metal (copper) layers on the polymer surfaces are characterized in terms of the microstructure, surface chemistry, wettability, and electrical conductivity. Notably, selective metallization with promising electrical conductivity (i.e., 6.47 × 10 6 S m −1 for ABS and 5.27 × 10 6 S m −1 for PLA parts) is achieved on both linear and curvilinear polymer surfaces. Moreover, strong adhesion between the metallized layer and the 3Dprinted structures was confirmed by adhesion tests. Detailed evaluation of the proposed hybrid metallization route unlocks great potential to advance the field of conductive surface metallization on 3D-printed polymers.

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Section: Methodsmentioning

confidence: 99%

Selective Surface Metallization of 3D-Printed Polymers by Cold-Spray-Assisted Electroless Deposition

Akin,

Nath,

Jun

2023

ACS Appl. Electron. Mater.

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“…Among the various plating techniques, laser-assisted metallization is considered a promising approach for metallization on both common surfaces, such as polyimide, and challenging surfaces, such as PTFE. When compared with other microfabrication techniques, such as photolithography, , inkjet printing, and screen printing, DLW offers several advantages, including high spatial resolution, environmental friendliness, fast processing rate, and the capability to metallize a wide range of materials, such as glass, , polymers, , paper, and other delicate carbon-based materials . Laser-assisted metallization has demonstrated flexibility, effectiveness, and ability to produce sophisticated and complex structures with high reproducibility.…”

Section: Introductionmentioning

confidence: 99%

Commercial-Grade Dielectrics Surface Metallization by Direct Laser Deposition from Deep Eutectic Solvents

Avilova,

Khairullina,

Levshakova

et al. 2024

ACS Appl. Electron. Mater.

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In this study, we explore the feasibility of a promising approach to fabricate conductive copper patterns with arbitrary topology on various dielectric substrates using direct laser metallization from deep eutectic solvents. We demonstrate the capability to print on industrially relevant dielectric materials, including polyimide, fiberglass plastic, and polytetrafluoroethylene (PTFE) substrates. We investigate the geometric and electrical characteristics of the resulting patterns and their composition. Our findings highlight the significant influence of the substrate material on both the formation rate of structures and their final properties. The characteristic resistance of the fabricated copper patterns is in the range from 0.23 to 1.64 Ω × mm2/m. The rate of pattern formation varied from 0.5 to 3.5 mm/s, depending on the substrate used.

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“…Therefore, in recent years, methods of direct laser writing (DLW) have been developed rapidly, and soon may provide a significant technological step in microelectronics manufacturing. In comparison with alternative microfabrication techniques (e.g., photolithography [17,18], inkjet printing [19], and screen printing [20]) DLW has a number of advantages, for example, high localization spatial resolution, environment friendliness, fast processing rate, and the possibility to plating a wide range of materials like glass [21,22], polymers [22,23], paper or other fragile carbon-based materials 24], etc. .…”

Section: Introductionmentioning

confidence: 99%

Fabrication of copper patterns on industrial-used dielectric substrates by direct laser metallization from deep eutectic solvents

Avilova

Khairullina

Eltysheva

et al. 2023

Preprint

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In this study, we show the possibilities of developing a method for manufacturing electrically conductive copper patterns of arbitrary topology on various dielectric substrates by laser-induced synthesis from deep eutectic solvents. The possibility of printing on the industrially demanded dielectrics is shown, e.g., on polyimide, fiberglass plastic, and polytetrafluoroethylene (PTFE) substrates. The geometric and electrical properties of the resulting structures, as well as their composition, have been studied. The influence of the substrate material is shown to be substantial for the effective rate of formation of structures and their final properties.

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Selective metallization on glass surface by laser direct writing combined with supersonic particle deposition

Cited by 10 publications

References 15 publications

Selective Surface Metallization of 3D-Printed Polymers by Cold-Spray-Assisted Electroless Deposition

Selective Surface Metallization of 3D-Printed Polymers by Cold-Spray-Assisted Electroless Deposition

Commercial-Grade Dielectrics Surface Metallization by Direct Laser Deposition from Deep Eutectic Solvents

Fabrication of copper patterns on industrial-used dielectric substrates by direct laser metallization from deep eutectic solvents

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