2017 IEEE International Interconnect Technology Conference (IITC) 2017
DOI: 10.1109/iitc-amc.2017.7968949
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Replacing copper interconnects with graphene at a 7-nm node

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Cited by 28 publications
(18 citation statements)
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“…[4][5][6][7][8][9][10] In order to be integrated into planar circuitry, as conductive interconnections [11][12][13] or active channels, the graphene film has to be patterned into narrow ribbons with controlled width and precise spatial arrangement. [14][15][16][17] Usually, graphene nanoribbons (GNRs) of tens of nanometers wide are etched out of graphene monolayer, by using sophisticated electron beam lithography (EBL), 18 which is unfortunately too expansive to implement for large-scale flexible electronics. In contrast, selfassembly GNRs can be synthesized from molecules in solution environment, 19,20 by unzipping multi-walled carbon nanotubes 21 or by reducing graphene oxide flakes, 22 which provide promising approaches to fabricate nearly perfect GNR segments.…”
Section: Introductionmentioning
confidence: 99%
“…[4][5][6][7][8][9][10] In order to be integrated into planar circuitry, as conductive interconnections [11][12][13] or active channels, the graphene film has to be patterned into narrow ribbons with controlled width and precise spatial arrangement. [14][15][16][17] Usually, graphene nanoribbons (GNRs) of tens of nanometers wide are etched out of graphene monolayer, by using sophisticated electron beam lithography (EBL), 18 which is unfortunately too expansive to implement for large-scale flexible electronics. In contrast, selfassembly GNRs can be synthesized from molecules in solution environment, 19,20 by unzipping multi-walled carbon nanotubes 21 or by reducing graphene oxide flakes, 22 which provide promising approaches to fabricate nearly perfect GNR segments.…”
Section: Introductionmentioning
confidence: 99%
“…This paper is focused on the research and development of novel high-performance on-chip interconnections for next-generation ICs. Super-and nanoconductors, radio frequency and optical commutation lines, carbon nanotubes, and graphene are the promising types of advanced integrated interconnections [2][3][4][5]. However, optical interconnecting is characterized by some important advantages over its counterparts and can solve the problem for various integrated devices in the immediate future [6][7][8].…”
Section: Introductionmentioning
confidence: 99%
“…2, we show the resistivity of 7 nm diameter MWCNT with lengths up to 10 µm while varying N c . We compare the resistivity of copper (Cu) lines with line widths of 22, 14, 10 and 7 nm [33]. We observe that doping improves CNT resistivity and achieves even lower resistivity than pristine CNTs and Cu lines.…”
Section: Electrical Rc Modelmentioning
confidence: 99%