2012
DOI: 10.1007/s00339-012-7024-1
|View full text |Cite
|
Sign up to set email alerts
|

Removal of nanoparticles on silicon wafer using a self-channeled plasma filament

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
5

Citation Types

0
6
0

Year Published

2015
2015
2021
2021

Publication Types

Select...
4
1
1

Relationship

0
6

Authors

Journals

citations
Cited by 8 publications
(6 citation statements)
references
References 11 publications
0
6
0
Order By: Relevance
“…That is, high-pressure gas passes through the nozzle to generate airflow to sweep particles on the surface. Xu et al removed 60–80% of SiO 2 particles from the surface with a jet spray nozzle, accelerated by a N 2 gas flow. In addition to the above traditional methods, several new methods have been proposed to remove particles from the surface, such as gas bullets, plasma, and electrostatics …”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…That is, high-pressure gas passes through the nozzle to generate airflow to sweep particles on the surface. Xu et al removed 60–80% of SiO 2 particles from the surface with a jet spray nozzle, accelerated by a N 2 gas flow. In addition to the above traditional methods, several new methods have been proposed to remove particles from the surface, such as gas bullets, plasma, and electrostatics …”
Section: Introductionmentioning
confidence: 99%
“…19−21 Xu et al 22 removed 60−80% of SiO 2 particles from the surface with a jet spray nozzle, accelerated by a N 2 gas flow. In addition to the above traditional methods, several new methods have been proposed to remove particles from the surface, such as gas bullets, 23 plasma, 24 and electrostatics. 25 Although the methods were developed to remove nanoparticles from the surface, no approach was reported to differentially remove nanoparticles from a surface based on the property of particles.…”
Section: Introductionmentioning
confidence: 99%
“…Given the rapid developments in the microelectronics industry, the requirements related to the cleanliness of the ultrasmall parts used in the industry are becoming more stringent. The presence of micro/nanoparticles of various contaminants can adversely affect the quality of precision devices, semiconductors, and high-threshold optical components [1][2][3][4]. Conventional laser-cleaning methods such as dry laser cleaning [5], stream/wet laser cleaning [6,7], and matrix laser cleaning have several disadvantages [8].…”
Section: Introductionmentioning
confidence: 99%
“…Conventional laser-cleaning methods such as dry laser cleaning [5], stream/wet laser cleaning [6,7], and matrix laser cleaning have several disadvantages [8]. For example, they have low removal efficiencies in the case of nanoparticles and can damage the substrate [1]. Thus, there are ongoing efforts to develop improved cleaning technologies.…”
Section: Introductionmentioning
confidence: 99%
“…An alternative dry cleaning method by using laser shock waves has been demonstrated to remove the submicron particles from solid surfaces [13][14][15][16]. In this method, the laser beam direction is parallel to the substrate, and a gap exists between the laser beam and substrate.…”
Section: Introductionmentioning
confidence: 99%