Reduction of annealed-induced wafer defects in dual-damascene copper interconnects

Wahab, Y. Abdul; Ahmad, A.F.; Hussin, H.; Soin, Norhayati

doi:10.1016/j.microrel.2012.07.008

Cited by 7 publications

(1 citation statement)

References 12 publications

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“…Several researchers also used modified abrasive particles and various dispersants to reduce the surface scratches. [27][28] In this study, a kind z E-mail: cwtjy206@163.com of dispersant agent was applied to reduce the scratches on the copper surface during CMP. Firstly, the defect map and scratch counts as a function of dispersant were studied by using defect scan tool and scanning electron microscope (SEM) reviewer, the relationship between dispersant agent and particle size distribution (PSD) of the slurry was studied, the zeta potential of the slurry as a function of EDA concentration was also studied, then the effect of dispersant agent on large particle counts and wettability of the slurry was investigated, and the mechanism for scratch reduction was also discussed.…”

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Role of Dispersant Agent on Scratch Reduction during Copper Barrier Chemical Mechanical Planarization

Liu

Wang

et al. 2018

ECS J. Solid State Sci. Technol.

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The chemical mechanical planarization (CMP) has been one of the major manufacturing process to provide global and local surface planarizations in integrated circuits (IC) fabrications. Defects such as micro-scratches generated during CMP can lead to severe circuit failure, which affects yield. In the present work, ethoxylated decylalchohol (EDA) was used as dispersant agent to prevent the particles agglomeration to reduce scratches. Firstly, the effect of EDA on particle size distribution (PSD) of the slurry was investigated by dynamic light scattering (DLS) method. Then the effect of EDA on large particle counts (LPC) was studied through a dual sensor single particle optical sensing (SPOS) analysis method. The wetting ability of slurries as a function of EDA concentration was also studied. Finally, the defect scan tool and scanning electron microscope (SEM) reviewer were used to identify the scratch defects. The results show that the addition of EDA into the slurry can enhance the dispersity of colloidal silica abrasives and significantly reduce the number of large particles in the slurry, the SEM review results show that the scratch counts remarkably decreases with EDA concentration increasing. It can be demonstrated that the EDA can effectively reduce the scratch counts.

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confidence: 99%