Reducing thermal crosstalk in ten-channel tunable slotted-laser arrays

Mathews, Ian; Abdullaev, Azat; Lei, Shenghui; Enright, Ryan; Wallace, Michael J.; Donegan, John F.

doi:10.1364/oe.23.023380

Cited by 21 publications

(8 citation statements)

References 11 publications

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“…Thus, it should be possible to athermalise a full laser array: however, the thermal cross-talk between adjacent lasers would be a significant factor in the successful operation of this system. Taking this crosstalk into account will require further modelling, building on our previous work [15].…”

Section: Laser Athermal Characterisationmentioning

confidence: 99%

“…Towards this, materials-based athermal ring resonators [13] and DBR gratings [14] having been demonstrated in the literature. Furthermore, if athermalising a full WDM laser array, it is necessary to take thermal crosstalk between adjacent lasers into account, since this has been shown to be a significant issue in photonics integrated circuits (PICs) [15].…”

Section: Introductionmentioning

confidence: 99%

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Athermal operation of multi-section slotted tunable lasers

et al. 2017

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Two distinct athermal bias current procedures based on thermal tuning are demonstrated for a low-cost, monotlithic, three section slotted single mode laser, achieving mode-hop free wavelength stability of ± 0.04 nm / 5 GH z over a temperature range of 8-47 • C. This is the first time that athermal performance has been demonstrated for a three-section slotted laser with simple fabrication, and is well within the 50 GHz grid spacing specified for DWDM systems. This performance is similar to experiments on more complex DS-DBR lasers, indicating that strong athermal performance can be achieved using our lower-cost three section devices. An analytical model and thermoreflectance measurements provide further insight into the operation of multi-section lasers and lay the foundation for an accurate predictive tool for optimising such devices for athermal operation.

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Section: Laser Athermal Characterisationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Athermal operation of multi-section slotted tunable lasers

et al. 2017

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“…R = 9.2 is the Ohmic resistance of the laser, V D + V S = 0.8865 V are the diode (V D ) and series (V S ) voltages, respectively, while Z T is the thermal impedance with an approximate value of 75.43 ± 3.12 K/W. All values are estimated from measurements taken for an array of similar highorder grating, all-active DBR lasers by I. Matthews et al in [26]. U is the wall-plug efficiency of the laser defined as P out /P in with P out the output power of the device.…”

Section: Theoretical Methodsmentioning

confidence: 99%

Athermal Tuning for a Two-Section, All-Active DBR Laser With High-Order Grating

et al. 2018

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We incorporate thermal effects for injection currents ranging up to 150 mA in order to model the tuning behavior of a two-section, all-active distributed-Bragg-reflector (DBR), ridge-waveguide semiconductor laser utilized for a single-mode operation. In particular, we investigate wavelength tuning as a function of injected currents within the grating and phase/gain sections of the laser cavity and examine how any athermal lasing conditions may arise. The effect of thermal drift on the resonant wavelength due to a change in refractive index as well as thermal expansion of the laser cavity is included within a traveling wave analysis (TWA). From the TWA, the spatial distribution of gain along the active region of the laser is also derived in order to help describe the tuning behavior for a high-order (37th) grating previously optimized to minimize linewidth. A comparative analysis with a single mirrored, active-passive DBR laser is also included. Results show a good agreement with reported experimental data and compare well with the wavelength stability of other laser devices.

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“…In reality, heat dissipation in the laser is distributed over the electrically active regions of the laser structure and can be better estimated using a Joule-heating model. 4,20 However, due to the concentrated nature of the heat source modelled here we expect our simulation results to provide a conservative estimate of μTEC performance.…”

Section: Numerical Implementationmentioning

confidence: 99%

Integrated Thermoelectric Cooling for Silicon Photonics

Enright¹,

Lei²,

Cunningham³

et al. 2017

ECS J. Solid State Sci. Technol.

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Integrated silicon photonics has emerged as a scalable optoelectronic platform to meet the demands for increased bandwidth in communication networks. However, integration introduces new thermal challenges to achieving the required system performance. Here we present the design of a micro thermoelectric temperature controller integrated around a III-V-on-silicon hybrid waveguide. We briefly outline the thermal requirements to ensure suitable hybrid laser performance for a long reach optical communication application on a silicon photonics platform, namely an active region temperature of ≤ 54 • C. We then develop a multiphysics numerical model of a micro thermoelectric temperature controller integrated around the waveguide and assess our design in terms of ambient operating temperatures of 80 • C relevant for an integrated optoelectronic system. Our simulations indicate that state-ofthe-art electrodeposited bismuth telluride can achieve the required refrigeration with suitable system design optimization. Despite characteristically low cooling efficiencies compared to a macroscopic thermoelectric module solution, considering overall system energy consumption shows that targeted refrigeration using our integrated thermoelectric design can be beneficial when cooling up to ∼20% of the overall system thermal load. Our results show the promise of integrated thermoelectric temperature control to meet the thermal requirements for integrated silicon photonics under realistic operating conditions. © The Author With the promise of highly integrated, high performance optoelectronic devices for communication applications, silicon photonics has emerged as a scalable solution to meet the demands for increased bandwidth in communication networks. An ultimate vision for silicon photonics realizes the integration of both electronic and photonic functionality in optoelectronic devices.1,2 However, while such level of integration has the potential to significantly reduce packaging costs and improve optoelectronic system efficiency, it introduces new thermal challenges alongside already existing ones; all of which have to be dealt with against the backdrop of the need for more compact, higher performance and energy efficient thermal solutions. In particular, the performance of active photonic devices, such as semiconductor lasers and optical amplifiers, are temperature sensitive. Moreover, these active photonic devices are required to operate at temperatures significantly lower than their electronic counterparts and often below standards-defined operating ambient temperatures required for telecommunications equipment. In traditional non-integrated optoelectronic packages, this thermal requirement has been dealt with by isolating temperature sensitive devices and cooling them using centimeter-scale thermoelectric modules (TEC). However, this solution is poorly suited to integrated optoelectronic devices sharing the same substrate and will limit the minimum system size as industry evolves toward an optoelectronic system-in-package archi...

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Reducing thermal crosstalk in ten-channel tunable slotted-laser arrays

Cited by 21 publications

References 11 publications

Athermal operation of multi-section slotted tunable lasers

Athermal operation of multi-section slotted tunable lasers

Athermal Tuning for a Two-Section, All-Active DBR Laser With High-Order Grating

Integrated Thermoelectric Cooling for Silicon Photonics

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