Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268) 1997
DOI: 10.1109/pep.1997.656468
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Recent progress in flexible moulding and reliability investigation of CSP and BGA-packages using advanced interconnection technology

F. Ansorge
1
,
Karl‐Friedrich Becker2,
R. Ehrlich3
et al.
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