Real time joint resistance monitoring during solder reflow

Xu, Di; Hook, Michael David; Mayer, Michael

doi:10.1016/j.jallcom.2016.11.357

Cited by 6 publications

(4 citation statements)

References 25 publications

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“…Many researchers have reported that the resistance of joints can reflect the welding quality [ 22 , 23 , 24 ]. This method is non-destructive and can be monitored in real time.…”

Section: Resultsmentioning

confidence: 99%

Ultrafast Parallel Micro-Gap Resistance Welding of an AuNi9 Microwire and Au Microlayer

Zhang

Wang

et al. 2021

Micromachines

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Welding between an AuNi9 microwire and Au microlayer is of great importance for fabricating electrical contact structures for high precision inertial devices, satellite slip ring brushes, robots, etc. In this paper, the achievement of parallel micro-gap resistance welding (PMRW) with 200-μm AuNi9 microwires on a 3-μm Au layer was presented. The study on the orthogonal design of the experiment was carried out. The effect of the process parameters (welding current, welding time, and welding pressure) was discussed in reference to the morphologies and tensile force of the joint using range analysis. It is shown that too much or too little heat input will decrease the welding performance. A group of optimized process parameters (0.275 kA welding current, 3 ms welding time, and 28.7 N welding pressure) was obtained. During the welding process, the dynamic resistance of the whole welding system was measured, which can reflect the welding quality. Finite element simulation is utilized to calculate the welding temperature. The highest temperature was located in the center area of the AuNi9 microwire, reaching 1397.2 °C, which is higher than the melting point of AuNi9. By contrast, the highest temperature for the pad was 826.47 °C (lower than the melting point of Au). Hence, under optimized process parameters, a transient interfacial reaction between the liquid AuNi9 microwire and solid Au pad occurred, and the strength of the welded joint reached 5.54 N.

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“…Many researchers have reported that the resistance of joints can reflect the welding quality [ 22 , 23 , 24 ]. This method is non-destructive and can be monitored in real time.…”

Section: Resultsmentioning

confidence: 99%

Ultrafast Parallel Micro-Gap Resistance Welding of an AuNi9 Microwire and Au Microlayer

Zhang

Wang

et al. 2021

Micromachines

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“…It was assumed that the flow in the horizontal gap is limited only by the resistance associated with the viscosity of the liquid. The time required to fill the volume between two parallel plates distant by D, at length L, in the case of the horizontal influence of the liquid, is [7,13]:…”

Section: Solderability Parametersmentioning

confidence: 99%

Industrial Soldering Process Simulator

Bąkała

2023

Applied Sciences

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Determination of the physico-chemical interactions between liquid and solid substances is a key technological factor in many industrial processes in metallurgy, electronics or the aviation industry, where technological processes are based on soldering/brazing technologies. Understanding of the bonding process, reactions between materials and their dynamics enables to make research on new materials and joining technologies, as well as to optimise and compare the existing ones. The paper focuses on a wetting force measurement method and its practical implementation in industrial applications. Soldering simulation is a process in which simulation tools are used to model and simulate soldering processes. With simulation, different soldering methods and parameters can be tested to identify the best approach and minimize the risk of errors and failures in the real process. Soldering simulation can be used to optimize the soldering process and increase productivity, as well as to train personnel.

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“…In this work, we study the sintering process of silver paste with an improved real time resistance monitoring technology based on the method used previously for a solder reflow study [18]. We present a larger range of resistance measurement (10 -5 -10 11 Ω), and provide a more continuous measurement than previous methods [3,5,10].…”

Section: A C C E P T E D Accepted Manuscriptmentioning

confidence: 99%

“…For the test setup, the oven, multiplexer, connecting materials, and temperature measurement are the same as in [18]. In addition, an Agilent B2911A precision source/measure unit and an Agilent 34420A nanovoltmeter is used for resistance measurement, in 2-wire mode (for >1 Ω) and 4-wire mode (for < 1Ω), respectively.…”

Section: Sintering and Resistance Measurementsmentioning

confidence: 99%

Real time resistance monitoring during sintering of silver paste

Kim

Hook

et al. 2018

Journal of Alloys and Compounds

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Real time resistance monitoring technology is used to study the silver sintering process.Signals of joint resistance show events such as resistance increase to >10 GΩ, abrupt resistance drop from >10 GΩ to <1 kΩ, and gradual resistance drop to <1 mΩ. Based on cross-sectioning of samples at various stages of sintering and differential scanning calorimetry (DSC), we propose a correlation between resistance signal and solvent evaporation, capping agent degradation, and silver sintering. We identified distinct clusters of sintered silver of samples removed from the oven when the resistance drops to ~2.94 Ω.

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Real time joint resistance monitoring during solder reflow

Cited by 6 publications

References 25 publications

Ultrafast Parallel Micro-Gap Resistance Welding of an AuNi9 Microwire and Au Microlayer

Ultrafast Parallel Micro-Gap Resistance Welding of an AuNi9 Microwire and Au Microlayer

Industrial Soldering Process Simulator

Real time resistance monitoring during sintering of silver paste

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