Radiative cooling: A review of fundamentals, materials, applications, and prospects

Zhao, Bin; Hu, Mingke; Ao, Xianze; Chen, Nuo; Pei, Gang

doi:10.1016/j.apenergy.2018.12.018

Cited by 579 publications

(300 citation statements)

References 143 publications

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“…The electronic components were installed on the evaporation side of the MHP in the MHP-RC system, which is fixed by a cover plate; meanwhile, the radiative plate was stuck with the spectrally selective absorbing material and was installed on the condensation side. Furthermore, the selective absorption material was characterized by a lower emissivity in the solar irradiation band (0.25-2.5 μm) in the daytime and a higher reflectivity in the long-wavelength band in the nighttime, especially in the atmospheric window band with the wavelength of 8-13 μm [25,27]. It is also worth mentioning that heat transfer started when the temperature of the MHP evaporation side was higher than that of its condensation side because the MHP is a gravity type heat pipe.…”

Section: System Descriptionmentioning

confidence: 99%

“…To better calculate the error between the experimental data and the calculated values, the root mean square error (RMSE) and mean absolute error (MAE) were used to evaluate the accuracy of the model, which are expressed as Equations (24) and (25) [40,41]:…”

Section: The Error Of Experiments and Calculationmentioning

confidence: 99%

“…In order to further reduce the power consumption of the fans, the heat dissipation in the condensation section of a microchannel heat pipe (MHP) using fans is replaced by sky radiative cooling (R) and convection (C) technologies (referred to as RC) in this paper, which is based on enlightenment from Ezekwe's research [23]. Radiative cooling utilizes outer space as a natural cold source with a temperature close to 4 K, and the heat generated by electronic components is transferred to outer space in the form of electromagnetic waves [24][25][26]. The novel heat dissipation system takes full advantage of the high thermal conductivity of MHP and free cooling of RC technology [27].…”

Section: Introductionmentioning

confidence: 99%

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Numerical and Experimental Study on the Heat Dissipation Performance of a Novel System

Shen

Jiang

et al. 2019

Energies

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In order to better release the heat generated by the electronic components, a novel heat dissipation system is proposed, which combines a microchannel heat pipe (MHP) with a high thermal conductivity and a radiative plate with a high emissivity at nighttime. First, a simple testing rig was made with an MHP and a radiative plate, where the radiative plate was made of acrylic resin, a curing agent, thinner, and aluminum plate, and had strong radiative cooling at nighttime. Second, the mathematical model was initially established and verified using experiments, where it was shown that the agreement between numerical and experimental data was well within experimental uncertainties. Comprehensive simulation investigations were conducted by varying wind speed, relative humidity, the cloudiness coefficient, dimension of the radiative plate, and tilted angle. The results show that: (1) the emissivity of the radiative plate was about 0.311 in the daytime and about 0.908 in the nighttime; (2) the influence of wind speed on reducing the component surface temperature was greater than the cloudiness coefficient and relative humidity; (3) the width of the radiative plate had a greater effect on heat dissipation than on its length, and the maximum size of radiative plate was recommended to be 400 mm × 400–500 mm (length × width), which was equipped with a single MHP (width: 60 mm). Additionally, the tilted angle of the radiative plate should be kept within 30° of the horizontal level. In conclusion, the novel heat dissipation system had a superior application value for providing assisted electronic component cooling in the nighttime.

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Section: System Descriptionmentioning

confidence: 99%

Section: The Error Of Experiments and Calculationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Numerical and Experimental Study on the Heat Dissipation Performance of a Novel System

Shen

Jiang

et al. 2019

Energies

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“…To control the surface emittance, nanostructure-based surfaces (e.g., metasurfaces 3,8 and metallic-dielectric nanowires 9 ) or films (metal 10 , semiconductor 11,12 , and multilayer films [13][14][15][16][17] ) are demonstrated with low-surface emittance over the whole IR range, and yet the radiative heat transfer is blocked, causing severe heat instability 18 . Wavelength-selective emitters [19][20][21][22][23][24][25] with radiative cooling [26][27][28][29][30][31] in the non-atmospheric window (5-8 μm) 18,20,32 are adopted to mitigate the heat instability without influencing the IR camouflage. However, they cannot operate at high temperature (<523 K) 18,20,32 .…”

Section: Introductionmentioning

confidence: 99%

High-temperature infrared camouflage with efficient thermal management

et al. 2020

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High-temperature infrared (IR) camouflage is crucial to the effective concealment of high-temperature objects but remains a challenging issue, as the thermal radiation of an object is proportional to the fourth power of temperature (T 4). Here, we experimentally demonstrate high-temperature IR camouflage with efficient thermal management. By combining a silica aerogel for thermal insulation and a Ge/ZnS multilayer wavelength-selective emitter for simultaneous radiative cooling (high emittance in the 5-8 μm non-atmospheric window) and IR camouflage (low emittance in the 8-14 μm atmospheric window), the surface temperature of an object is reduced from 873 to 410 K. The IR camouflage is demonstrated by indoor/outdoor (with/without earthshine) radiation temperatures of 310/248 K for an object at 873/623 K and a 78% reduction in with-earthshine lock-on range. This scheme may introduce opportunities for high-temperature thermal management and infrared signal processing.

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“…Recent advances in radiative cooling [ 1–3 ] have attracted cross‐disciplinary attention in the fields of nanophotonics, optical metamaterials, thermal dynamics, energy, environment, and building. The idea behind passive photonic radiative cooling is to tailor photonic structures and materials for specific conditions to achieve a nonzero nontrivial net cooling power and save energy.…”

Section: Introductionmentioning

confidence: 99%

Broadband Radiative Cooling and Decoration for Passively Dissipated Portable Electronic Devices by Aperiodic Photonic Multilayers

Chen

2020

Annalen der Physik

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Broadband radiative cooling and decoration for passively dissipated portable electronic devices by an aperiodic photonic multilayer structure is proposed theoretically. The designed optical structure can strongly emit in the infrared region from 6.9 to 40 µm within the blackbody radiation spectrum of electronic devices. Its emission spectrum exhibits good uniformity across different incident angles, enhancing the cooling performance. At an ambient temperature of 20 • C, the designed broadband radiative cooler can produce a net cooling power of 46.88 W m −2 , 65.95% higher than pure silica of the same thickness. At a typical junction temperature of 90 • C allowed by the microprocessor die, the net cooling power reaches 239.55 W m −2 , still with an 18.21% improvement over pure silica glass. In the visible regime, the designed structure displays a low uniformity in the reflection spectrum, producing an elegant color shift from the translucent gray color of normal direction to the silver and highly reflective look at a grazing angle. These results can be useful in future exterior and thermal designs of portable electronic devices.

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Radiative cooling: A review of fundamentals, materials, applications, and prospects

Cited by 579 publications

References 143 publications

Numerical and Experimental Study on the Heat Dissipation Performance of a Novel System

Numerical and Experimental Study on the Heat Dissipation Performance of a Novel System

High-temperature infrared camouflage with efficient thermal management

Broadband Radiative Cooling and Decoration for Passively Dissipated Portable Electronic Devices by Aperiodic Photonic Multilayers

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