2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS) 2022
DOI: 10.1109/icecs202256217.2022.9971043
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Qubit Bias using a CMOS DAC at mK Temperatures

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Cited by 4 publications
(1 citation statement)
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“…3,4) Using interposers is a promising route to evade the need for full single-chip integration of all functionalities. [5][6][7][8] However, thermal stability down to cryogenic temperatures is a warranted concern when transferring this established technology at room temperature to cryogenic silicon qubit experiments. Although both the interposer chip and quantum dot (QD) devices are typically made of silicon, there is a possibility of coefficient of thermal expansion mismatch between the metallic bumps and the silicon chips at cryogenic temperature.…”
Section: Introductionmentioning
confidence: 99%
“…3,4) Using interposers is a promising route to evade the need for full single-chip integration of all functionalities. [5][6][7][8] However, thermal stability down to cryogenic temperatures is a warranted concern when transferring this established technology at room temperature to cryogenic silicon qubit experiments. Although both the interposer chip and quantum dot (QD) devices are typically made of silicon, there is a possibility of coefficient of thermal expansion mismatch between the metallic bumps and the silicon chips at cryogenic temperature.…”
Section: Introductionmentioning
confidence: 99%