Quantifying CD-SEM contact hole roughness and shape combined with machine learning-based pattern fidelity scores for process optimization and monitoring
Abstract:Process window qualification using focus-exposure wafers is an essential step in lithography and a key use case for CD-SEM metrology. An automated analysis using the correlation between CD and focus/dose is easily possible but rarely done due to missing safety checks. Pattern fidelity that is analyzed by eye and problematic focus/dose conditions that may cause pattern degradation are excluded by hand. Specifically, when EUV lithography is utilized for exposing the most critical layers, roughness estimation bec… Show more
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