2012
DOI: 10.1063/1.3675453
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Pulsed metal organic chemical vapor deposition of nearly latticed-matched InAlN/GaN/InAlN/GaN double-channel high electron mobility transistors

Abstract: High quality, nearly lattice-matched InAlN/GaN/InAlN/GaN double-channel heterostructures were grown on sapphire by pulsed-metal-organic-chemical-vapor-deposition (PMOCVD). High electron mobility of 1414 cm 2 /Vs was achieved along with a two-dimensional-electron-gas density of 2.55 Â 10 13 cm À2. We attribute it to the high quality PMOCVD-grown InAlN barriers and, additionally, to the novel GaN layer growth between two InAlN barriers, which consists of a thin GaN spacer to prevent indium-redistribution and ind… Show more

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Cited by 36 publications
(19 citation statements)
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“…We attribute the much lower trap states to a 2 nm LT-GaN spacer deposited on the bottom InAlN/AlN barrier, capable of avoiding the risk of indium cluster formation and indium redistribution during the high temperature GaN channel growth. 9 Contrarily, no cap was grown on the top InAlN barrier, enabling the vulnerability to subsequent device processes, especially high temperature annealing (830 C here).…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…We attribute the much lower trap states to a 2 nm LT-GaN spacer deposited on the bottom InAlN/AlN barrier, capable of avoiding the risk of indium cluster formation and indium redistribution during the high temperature GaN channel growth. 9 Contrarily, no cap was grown on the top InAlN barrier, enabling the vulnerability to subsequent device processes, especially high temperature annealing (830 C here).…”
Section: Resultsmentioning
confidence: 99%
“…9 The epitaxial structure is composed of, from the substrate up, a 1.6 lm GaN buffer layer, a 1 nm AlN interlayer, a 12 nm In 0.17 Al 0.83 N bottom barrier layer, a 20 nm GaN layer, a 1 nm AlN interlayer, and a 12 nm In 0.17 Al 0.83 N top barrier layer. While a low reverse leakage current on the order of 1 and 40 lA/mm at gate-drain voltage of V GD ¼ À10 and À20 V, respectively, was achieved, 10 it still exhibited three orders of magnitude higher than that of AlGaN barrier devices fabricated in our laboratory, which suggested the possible existence of relatively higher trap or/and dislocations density.…”
Section: Experimental Methodsmentioning
confidence: 99%
“…A prerequisite for a monolithic approach to the realization of such devices is high quality epitaxial DC InAlN/GaN heterostructures. Fortunately, our group has successfully overcome the growth impediment by using pulsed metal organic chemical vapor deposition (PMOCVD), [13][14][15][16] an inspiring method and facilitating the InAlN material-related applications. Here, we report on a detailed fabrication and characterization of HEMTs made of those DC InAlN/GaN heterostructures for electronic applications like frequency multipliers and mixers.…”
Section: Introductionmentioning
confidence: 99%
“…In previous work, we have successfully grown high quality nearly lattice-matched InAlN/GaN heterostructures by pulsed MOCVD (PMOCVD) and demonstrated the potential advantages of PMOCVD [8][9][10]. Fig.…”
Section: Introductionmentioning
confidence: 96%