Prevention of Cracking From RDL Stress and Dicing Defects in Glass Substrates

McCann, Scott; Sato, Yoichiro; Sundaram, Venkatesh; Tummala, Rao; Sitaraman, Suresh K.

doi:10.1109/tdmr.2015.2507978

Cited by 27 publications

(11 citation statements)

References 21 publications

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“…Furthermore, in order to detect potential defects in the middle of the manufacturing process, we did not finalize the ultrasonic transducers into an array of piezoelectric elements by means of mechanical dicing, and with the bonding of the lens (final stage). Due to the preliminary information about the defects (light grey) visualized in the center of the acoustic stack (Figure 5) and located in the adhesive 1 layer, we did not dice the samples by eliminating an additional variability source for the generation of micro-cracks, chipping, or delamination [35,36]. For this reason, we prepared 24 samples by organizing 4 lots, with 6 ultrasonic transducers per lot (Figure 6b).…”

Section: Methodsmentioning

confidence: 99%

Scanning Acoustic Microscopy (SAM): A Robust Method for Defect Detection during the Manufacturing Process of Ultrasound Probes for Medical Imaging

Bertocci

Grandoni

Djuric-Rissner

2019

Sensors

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The main aim of this paper is to provide the feasibility of non-destructive testing (NDT) method, such as scanning acoustic microscopy (SAM), for damage detection in ultrasound (US) probes for medical imaging during the manufacturing process. In a highly competitive and demanding electronics and biomedical market, reliable non-destructive methods for quality control and failure analysis of electronic components within multi-layered structures are strongly required. Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies, such as the acoustic stack of ultrasonic transducers. In this work, the application of SAM in an industrial scenario was studied for 24 samples of a phased array probe, in order to investigate potential internal integrity, to detect damages, and to assess the compliance of high-demanding quality requirements. Delamination, non-homogeneous layers with micron-thickness, and entrapped air bubbles (blisters) in the bulk of US probe acoustic stacks were detected and studied. Analysis of 2D images and defects visualization by means of ultrasound-based NDT method were compared with electroacoustic characterization (also following as pulse-echo test) of the US probe through an ad-hoc measurement system. SAM becomes very useful for defect detection in multilayered structures with a thickness of some microns by assuring low time-consuming (a limit for other NDT techniques) and quantitative analyses based on measurements. The study provides a tangible contribution and identifies an advantage for manufacturers of ultrasound probes that are oriented toward continuous improvement devoted to the process capability, product quality, and in-process inspection.

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Section: Methodsmentioning

confidence: 99%

Scanning Acoustic Microscopy (SAM): A Robust Method for Defect Detection during the Manufacturing Process of Ultrasound Probes for Medical Imaging

Bertocci

Grandoni

Djuric-Rissner

2019

Sensors

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“…Altogether, the crack begins near the RDL sidewall and progresses inward that results in the shrinkage of the metallic parts of the RDL. Furthermore, the analysis of this deviation is considered with a crack width of 0.18µm to 6.5µm in this work [2]. Based on the aforementioned physical dimensions and thermal conditions, a forthcoming subsection 2.2 unveils a comprehensive RLGC model of RDL with interfacial crack.…”

Section: Rdlmentioning

confidence: 99%

“…As a result of longer cycling upto 1000 cycles, the expansion and shrinkage of the metallic part generates a micro crack near the interfacing of a metallic and insulating layer. This crack could further compromise the signal integrity of the device and cause damage to the back end of the line [1,2]. Altogether, the physical and electrical attributes of each structure in the vicinity of the interconnect play a vital role in proper signaling transition.…”

mentioning

confidence: 99%

Impact of Interfacial Crack on Redistribution Layer of TSV based 3D Integration

Kumari

Chandrakar

Majumder

2023

Preprint

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The interfacial strength of redistribution layer (RDL) and passivation layer plays a crucial role in ensuring the optimal performance and reliability of through silicon vias (TSVs), as it significantly impacts their electrical characteristics and thermal stability, especially in high-density packaging with constrained space. Therefore, it is important to identify and address the interfacial cracks in the RDL that arises due to the factors like manufacturing defects, mechanical stress, and thermal cycling. Neglecting these issues can lead to a range of problems, including reduced device performance, intermittent or complete loss of functionality, and even permanent damage. Owing to ensure their reliability and longevity, this paper introduces for the first time considers the RDL cracks under heating and cooling conditions to model an equivalent electrical circuit and demonstrates the performance in terms of thermal stress, power dissipation, power delay product (PDP), crosstalk delay and power loss. Remarkably, our analysis of interfacial cracked TSV has yielded highly positive results. Specifically, a striking improvement of 22.29% have been observed in case of crosstalk delay, as the minimum crack width of 0.18µm at heating mode approached towards the defect-free condition. A thorough validation of the analytical results reveals an excellent agreement with the EM result, for a negligible deviation of only 3.4% observed in the scattering parameter. This close correspondence between the simulated and quantitative results lends a strong support to the accuracy and reliability of the research findings. Furthermore, this analysis elucidated that the cooling mode is significantly more susceptible to PDP than heating, with a vulnerability that is 7.19% higher at a crack width of 0.18µm.

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“…This stage is critical for the manufacturing process, and the fundamental requirement consisting in strong and homogeneous adhesion between materials must be satisfied. The major additional variability source for the generation of micro-cracks, chipping, or delamination [35,36] is provided by mechanical dicing stress (Figure 2b), considered a very critical operation for the manufacturing of the US probe. The factors of feed rate (mm/s), spindle revolution (rpm), diamond grains size and the density of grains in the blade, and the quality of the blade cooling water avoiding the impurities [37] are important for obtaining an US transducer without cracks or delamination.…”

Section: The Pdca Cycle Implementationmentioning

confidence: 99%

A Guideline for Implementing a Robust Optimization of a Complex Multi-Stage Manufacturing Process

et al. 2021

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In the industrial production scenario, the goal of engineering is focused on the continuous improvement of the process performance by maximizing the effectiveness of the manufacturing and the quality of the products. In order to address these aims, the advanced robust process optimization techniques have been designed, implemented, and applied to the manufacturing process of ultrasound (US) probes for medical imaging. The suggested guideline plays a key role for improving a complex multi-stage manufacturing process; it consists of statistical methods applied for improving the product quality, and for achieving a higher productivity, jointly with engineering techniques oriented to problem solving. Starting from the Six Sigma approach, the high definition of the production process was analyzed through a risk analysis, and thus providing a successful implementation of the PDCA (plan-do-check-act) methodology. Therefore, the multidisciplinary analysis is carried out by applying statistical models and by detecting the latent failures by means of NDT (non-destructive testing), i.e., scanning acoustic microscopy (SAM). The presented approach, driven by the statistical analysis, allows the engineers to distinguish the potential weak points of the complex manufacturing, in order to implement the corrective actions. Furthermore, in this paper we illustrate this approach by considering a pilot study, e.g., a process of US probes for medical imaging, by detailing all the guideline steps.

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Prevention of Cracking From RDL Stress and Dicing Defects in Glass Substrates

Cited by 27 publications

References 21 publications

Scanning Acoustic Microscopy (SAM): A Robust Method for Defect Detection during the Manufacturing Process of Ultrasound Probes for Medical Imaging

Scanning Acoustic Microscopy (SAM): A Robust Method for Defect Detection during the Manufacturing Process of Ultrasound Probes for Medical Imaging

Impact of Interfacial Crack on Redistribution Layer of TSV based 3D Integration

A Guideline for Implementing a Robust Optimization of a Complex Multi-Stage Manufacturing Process

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