2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) 2014
DOI: 10.1109/iccad.2014.7001401
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PowerCool: Simulation of integrated microfluidic power generation in bright silicon MPSoCs

Abstract: Abstract-Integrated microfluidic power generation and power delivery promises to be a disruptive packaging technology with the potential to combat dark silicon. It essentially consists of integrated microchannel-based electrochemical "flow cells" in a 2D/3D multiprocessor system-on-chip (MPSoC), that generate electricity to power up the entire or part of the chip, while also simultaneously acting as a high-efficiency microfluidic heat sink. Further development of this technology requires efficient modeling too… Show more

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Cited by 9 publications
(11 citation statements)
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“…One of the most promising lines is the development of energy-efficient processing architectures building blocks that would significantly enhance the energyproportionality of server processing power at the deep submicron era (i.e., beyond 28 nm technology nodes). The development of these building blocks will be achieved by using emerging technologies such as fully depleted silicon on insulator (FDSOI) [25] and gate-allaround nanowires [26], and integrated microfluidic cooling and power delivery [27]. This development would require modelling the power and thermal dissipations involved in the processing units, memory hierarchy, and the cooling and power delivery networks at the server level.…”
Section: Circuit Microarchitecturementioning
confidence: 99%
“…One of the most promising lines is the development of energy-efficient processing architectures building blocks that would significantly enhance the energyproportionality of server processing power at the deep submicron era (i.e., beyond 28 nm technology nodes). The development of these building blocks will be achieved by using emerging technologies such as fully depleted silicon on insulator (FDSOI) [25] and gate-allaround nanowires [26], and integrated microfluidic cooling and power delivery [27]. This development would require modelling the power and thermal dissipations involved in the processing units, memory hierarchy, and the cooling and power delivery networks at the server level.…”
Section: Circuit Microarchitecturementioning
confidence: 99%
“…The computational complexity of the thermal and electrochemical simulations are O(n 1.7 ) [19] and O(m 1.2 ) [15], respectively, where n and m are the dimensions of the thermal and electrochemical problems. Since the number of iterations of the outer loop is very low compared to n and m, the total complexity of our iterative approach is O(n 1.7 ), since n and m are of the same order of magnitude.…”
Section: Architecture Of the New Powercool Simulatormentioning
confidence: 99%
“…The height of the FCA layer was varied between 50 and 400 µm while the width of the individual microchannels was varied between 50 and 200 µm [14,15]. Channel dimensions below 50 µm result in a severe rise of hydraulic resistance, therefore limiting the flow rate below the level needed to achieve an effective cooling of the MPSoC.…”
Section: D Mpsoc Architecture and Floorplanmentioning
confidence: 99%
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