Power distribution modelling of high performance first level computer packages

Becker, Wiren D.; McCredie, B.D.; Wilkins, Gregory M.; Iqbal, Adeel

doi:10.1109/epep.1993.394554

Cited by 23 publications

(8 citation statements)

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“…Full-wave methods have been used to predict performance for arbitrary geometries over a wide frequency range for solid-plane structures [7,8]. However, accurate solutions using such methods often require long simulation times and extensive computational capabilities.…”

Section: Modeling Methodologymentioning

confidence: 99%

Accurate frequency domain modeling of LTCC solid‐gridded plane structures

Chen

Jancura

Virga

et al. 2003

Micro & Optical Tech Letters

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Shrinkage behavior of a plastic plays a critical role in determining the final dimensions of an injection‐molded part. It is well known that process conditions affect many properties of plastic parts, including shrinkage. This study applies the Taguchi method to systematically investigate the effects of process conditions on the shrinkage (along‐ and across‐the‐flow directions) of three plastics: high‐density polyethylene (HDPE), general‐purpose polystyrene (GPS), and acrylonitrile‐butadiene‐styrene (ABS). The results show that HDPE, a semicrystalline plastic, shrinks more than GPS and ABS, two amorphous materials. The extent of anisotropic shrinkage in the along‐the‐flow and across‐the‐flow directions for HDPE is different from GPS and ABS. More shrinkage occurs in the across‐the‐flow direction of HDPE than in its along‐the‐flow direction. The reverse is true for GPS and ABS. Mold and melt temperatures, along with holding pressure and holding time, are the most significant influences on the shrinkage behaviors of three materials, although the importance of each is different for each plastic. The optimal conditions for reducing shrinkage identified by the Taguchi method are experimentally verified and validated by t‐statistic tests. The prediction matches very well with the experimental value for the along‐the‐flow shrinkage of GPS.

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Section: Modeling Methodologymentioning

confidence: 99%

Accurate frequency domain modeling of LTCC solid‐gridded plane structures

Chen

Jancura

Virga

et al. 2003

Micro & Optical Tech Letters

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“…These methods were based on the seminal paper by Ruehli [25], which enabled the representation of interconnections using partial inductances. The PEEC-based methods were used to analyze Delta I or power supply noise in high-performance computers [26], packaged CMOS devices [27] and first level packages [29]. In [27], the effect of negative feedback due to power supply noise on nonlinear CMOS inverters has been discussed.…”

Section: Modeling Of Power Distribution Networkmentioning

confidence: 99%

“…In [27], the effect of negative feedback due to power supply noise on nonlinear CMOS inverters has been discussed. A birthday cake approach was used in [29] using PEEC, where multilayered packages were represented using a network of inductors. Finally, Fast Henry, a multipole based PEEC method was developed in [30] for speeding computations.…”

Section: Modeling Of Power Distribution Networkmentioning

confidence: 99%

Power distribution networks for system-on-package: status and challenges

Swaminathan

Kim

Novak

et al. 2004

IEEE Trans. Adv. Packag.

229

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Abstract-The power consumption of microprocessors isincreasing at an alarming rate leading to 2X reduction in the power distribution impedance for every product generation. In the last decade, high I/O ball grid array (BGA) packages have replaced quad flat pack (QFP) packages for lowering the inductance. Similarly, multilayered printed circuit boards loaded with decoupling capacitors are being used to meet the target impedance. With the trend toward system-on-package (SOP) architectures, the power distribution needs can only increase, further reducing the target impedance and increasing the isolation characteristics required. This paper provides an overview on the design of power distribution networks for digital and mixed-signal systems with emphasis on design tools, decoupling, measurements, and emerging technologies.

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“…Currents injected by active devices and/or power voltages applied to the conductors produce induced charges and currents on the conductor surfaces, which in turn generate induced electromagnetic fields. The electric field E(r) can be expressed in terms of a vector potential A(r) and a scalar potential Φ(r) as (1) where A(r) and Φ(r) are related to the charge and current densities q(r) and J(r) by the following relation: (2) (3)…”

Section: Electromagnetic Modeling and Analysis 31 Electromagnetic Fomentioning

confidence: 99%

“…With the ever increasing speed and density of digital integrated circuit systems, effects due to field interaction among IC chips, packages and PCB boards have become more and more the limiting factors in high speed system design [1][2][3]. Signal integrity effects such as propagation delay, crosstalk, and simultaneous switching noises (SSN) require more accurate and efficient electromagnetic analysis and modeling beyond the traditional static method with a few lumped circuit elements.…”

Section: Introductionmentioning

confidence: 99%

Electromagnetic modeling and signal integrity simulation of power/ground networks in high speed digital packages and printed circuit boards

Yuan¹

Proceedings 1998 Design and Automation Conference. 35th DAC. (Cat. No.98CH36175)

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The electromagnetic modeling and parameter extraction of digital packages and PCB boards for system signal integrity applications are presented. A systematic approach to analyze complex power/ ground structures and simulate their effects on digital systems is developed. First, an integral equation boundary element algorithm is applied to the electromagnetic modeling of the PCB structures. Then, equivalent circuits of the power/ground networks are extracted from the EM solution. In an integrated simulation scheme, the equivalent circuits are combined with signal nets, package models, device circuits, and other external circuitry for system level signal integrity analysis and simulation. This methodology has been implemented as software tools and applied to practical design problems. Effects related to power/ground networks, such as simultaneous switching noises, crosstalk, and ground discontinuity are analyzed for realistic designs. INTRODUCTIONWith the ever increasing speed and density of digital integrated circuit systems, effects due to field interaction among IC chips, packages and PCB boards have become more and more the limiting factors in high speed system design [1][2][3]. Signal integrity effects such as propagation delay, crosstalk, and simultaneous switching noises (SSN) require more accurate and efficient electromagnetic analysis and modeling beyond the traditional static method with a few lumped circuit elements. Particularly, the power/ground supply networks in digital circuits involve complex, large structures such as combinations of plane/partial planes and routed traces in multilayer environment, and are often tightly coupled with other parts of the circuit systems, such as signal networks and chip packages. Characterization of true distributed effect and frequency dependence is crucial. On the other hand, due to the overwhelming complexity of digital circuit board, full-wave rigorous electromagnetic field solutions, such as those used in microwave analysis [4], become impractical for digital application because of the extremely high computational requirement, and the difficulty of integrating with time-domain circuit type simulators and design environments used by digital designers. Therefore, EM modeling and simulation methodologies that can handle large complex digital designs with reasonable accuracy and efficiency, and can provide good macro models over extended frequency bands, are very much desired and thus present a challenge to us [5][6][7][8].This paper presents a systematic approach which includes an efficient method for the electromagnetic modeling of packages and power/ground structures, and an integrated process for the analysis and simulation of system signal integrity and SSN effect in practical digital designs. The focus of this work is to develop a fast, flexible and accurate electromagnetic model with a clear circuit interpretation for the power/ground network, and to integrate it with active device models, transmission line networks, and chip package parasitics in a ti...

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Power distribution modelling of high performance first level computer packages

Abstract: A methodology for obtaining a model of the power distribution of a computer package is presented. This model is suitable for determining the noise and aiding in the design of a computer package.

Cited by 23 publications

References 0 publications

Accurate frequency domain modeling of LTCC solid‐gridded plane structures

Accurate frequency domain modeling of LTCC solid‐gridded plane structures

Power distribution networks for system-on-package: status and challenges

Electromagnetic modeling and signal integrity simulation of power/ground networks in high speed digital packages and printed circuit boards

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