2017
DOI: 10.1142/s0218126618500342
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Power Analysis Approach for NoC-based Homogeneous Stacked 3D ICs

Abstract: Low-power consumption in three-dimensional integrated circuits (3D IC) design is becoming an important concern that cannot be neglected. The multiple layers/dies are stacked in 3D IC and communicate with each other through-silicon-vias (TSVs) to work as a single device in order to achieve high performance with minimum power dissipation. This paper demonstrates high-level power modeling approach for the power estimation of homogenous integration of Network-on-Chip (NoC)-based mesh architecture in 3D IC design. … Show more

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Cited by 5 publications
(7 citation statements)
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“…18 Modern industry control systems impose restrictions on the control signals due to the existing technological limitations. 911 In order to meet the requirements of robustness, a number of techniques are applied in the engineering tasks. 12,13 For instance, an application of various nonsquare parameter/polynomial matrices in the inverse model–based control algorithms, including the minimum variance/perfect control procedure, makes such control laws more robust.…”
Section: Introductionmentioning
confidence: 99%
“…18 Modern industry control systems impose restrictions on the control signals due to the existing technological limitations. 911 In order to meet the requirements of robustness, a number of techniques are applied in the engineering tasks. 12,13 For instance, an application of various nonsquare parameter/polynomial matrices in the inverse model–based control algorithms, including the minimum variance/perfect control procedure, makes such control laws more robust.…”
Section: Introductionmentioning
confidence: 99%
“…The power modeling approach of BFT network is discussed in this section. The proposed model further improves these techniques, in the electrical characteristics of the network, and most of the model equations are modified as described below.…”
Section: Power Modeling Methodology For 3d Icmentioning
confidence: 99%
“…Recently, 3D multistacked NoC architecture is introduced to reduce the overall power consumption of the IC. However, most of the work utilizes a simple model to represent the average power dissipation.…”
Section: Related Workmentioning
confidence: 99%
“…It also reduces the system power with higher performance. A macro-modeling approach for homogeneous integration of NoC based mesh architecture is proposed in [ 23 ]. The first part of the proposed model estimates the average power consumption of the NoC architecture of each core, while the second part estimates the average power of uniformly distributed TSVs.…”
Section: Literature Reviewmentioning
confidence: 99%
“…Our proposed macromodel have 3 parameters TD , SP and SV , instead of correlation parameters S c and T c [ 23 , 26 , 27 ]. S c and T c are spatial and temporal correlations.…”
Section: Power Macromodeling For Ip-based 3d Digital Systemmentioning
confidence: 99%