1992
DOI: 10.1016/0039-6028(92)90068-h
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Potassium adsorption and coadsorption with oxygen on a Si(111) surface

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Cited by 17 publications
(2 citation statements)
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“…We therefore assume that a similar process occurs during the KCl adsorption on the Si(111)7 × 7 substrate. Desorption of Cl in form of SiCl 2 and SiCl 4 species from Si(111)7 × 7, inducing etching of the substrate, is reported at slightly higher temperatures (starting at ~330 K) than RT 31 and with respect to K, significant desorption via first and second order processes, occurs at temperatures higher than those used in our experiments (up to 430 K) 32 33 . Thus, we suggest that adsorption of KCl on the Si(111)7 × 7 surface leads to an excess of K on the surface via a dissociation of KCl, allowing the formation of 3 ML (111) K-Cl-K areas.…”
Section: Discussionmentioning
confidence: 53%
“…We therefore assume that a similar process occurs during the KCl adsorption on the Si(111)7 × 7 substrate. Desorption of Cl in form of SiCl 2 and SiCl 4 species from Si(111)7 × 7, inducing etching of the substrate, is reported at slightly higher temperatures (starting at ~330 K) than RT 31 and with respect to K, significant desorption via first and second order processes, occurs at temperatures higher than those used in our experiments (up to 430 K) 32 33 . Thus, we suggest that adsorption of KCl on the Si(111)7 × 7 surface leads to an excess of K on the surface via a dissociation of KCl, allowing the formation of 3 ML (111) K-Cl-K areas.…”
Section: Discussionmentioning
confidence: 53%
“…A sample of size 208mm 2 is cut from p-type boron doped Si (5512) wafer having a resistivity of 10-15 ohm-cm. The sample was cleaned by modified Shiraki process [14] after that it is mounted in to a precision manipulator with the Ta sample holder. The sample is degassed at 600º C by direct resistive heating for 12 hour followed by repeated flashing to 1150º C for 5 second and cooling to RT at a very slow rate of 2º C/s.…”
Section: Methodsmentioning
confidence: 99%