We demonstrate that
copper-based super-thin high-efficiency boiling
heat transfer (BHT) interfaces can be obtained via electroplating
hierarchical nickel nanocone coverings on the surface of copper nanocone
cores. By regulating surface morphologies, wettability, and mass and
heat transfer properties of hierarchical structures, we reveal the
regulation rules of their performance. Based on this, we obtain the
optimized BHT interfaces with a thickness of only 6.4 μm, which
shows 228% enhancement in the maximal heat transfer coefficient, 71%
enhancement in the critical heat flux, and 68% decrease in the superheat
for the onset of nucleate boiling, as compared to the flat copper
surface. Our studies clearly indicate that, although the in situ growth
of nickel nanocones can unavoidably increase the interface thermal
resistance of hierarchical structures, its optimization can still
enhance BHT performance. This may be ascribed to the coupling of several
interface effects such as more heat transfer area, more nucleation
sites, smaller bubble departure sizes, and stronger liquid supply
ability caused by hierarchical structures. Our work opens up a new
avenue for the development of copper-based super-thin high-efficiency
BHT interfaces, which would help enhance the efficiency of energy
utilization and heat dissipation of various thermal devices.