Polyimides with low dielectric constants and dissipation factors at high frequency derived from novel aromatic diamines with bistrifluoromethyl pendant groups

Zhang, Yao; Huang, Shan; Lv, Xialei; Wang, Kuangyu; Yin, Huimin; Qiu, Siyao; Li, Jinhui; Zhang, Guoping; Sun, Rong

doi:10.1039/d3py00773a

Cited by 8 publications

(3 citation statements)

References 37 publications

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“…The T g of these two PI films was collected using a comprehensive thermal analyzer (microcomputer differential thermal balance, HT-1) in an argon atmosphere with a flow rate of 50 mL min –1 , at a temperature increase of 10 °C min –1 . PI-6 to PI-10 were obtained from different recently published literature sources, each exhibiting significant structural variations. − …”

Section: Methodsmentioning

confidence: 99%

Prediction and Interpretability Study of the Glass Transition Temperature of Polyimide Based on Machine Learning with Quantitative Structure–Property Relationship (T_g-QSPR)

Zhang,

Wang,

Chai

et al. 2024

J. Phys. Chem. B

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Section: Methodsmentioning

confidence: 99%

Prediction and Interpretability Study of the Glass Transition Temperature of Polyimide Based on Machine Learning with Quantitative Structure–Property Relationship (T_g-QSPR)

Zhang,

Wang,

Chai

et al. 2024

J. Phys. Chem. B

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“…They showed that the anisotropy and local chain rigidity of PI chains represented by DoP correlate to electrical energy loss rather than the dipole moment. Many studies about the dielectric properties of PIs, such as low- D k / D f PIs with cross-linking structures, long triphenyl side chains, and bulky bis(trifluoromethyl) biphenyl pendant groups, have been reported to date. However, no quantitative analysis of the anisotropic dielectric properties of PI films based on theoretical principles has been reported using reproducible experimental methods with variable humidity measurements for systematic molecular design of low- D k / D f PI.…”

Section: Introductionmentioning

confidence: 99%

Polarization Analysis and Humidity Dependence of Dielectric Properties of Aromatic and Semialicyclic Polyimides Measured at 10 GHz

Sawada,

Ando

2024

J. Phys. Chem. C

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In this study, dielectric constants (D k) and dissipation factors (D f) of 15 types of polyimides (PIs), including wholly aromatic, semialicyclic, partially fluorinated, and perfluorinated PIs, were measured in the transverse electric (TE011) mode at a frequency of 10 GHz and analyzed based on their chemical structures and the dominant factors of dielectric polarization per unit volume (P t). The relationships among the dipolar orientational (P d) and electronic (P e) polarizations and dielectric properties (D k and D f) were quantitatively investigated. Although a systematic correlation between the structure and D f of PIs has not yet been established, we found that the D f of PIs is anisotropic and linearly proportional to P d in the in-plane direction, which can be estimated from the D k and in-plane refractive index (n TE) at 1310 nm. This could be related to the bidirectional relationship between the real (D k) and imaginary (D f) parts of the relative permittivity. Furthermore, the D k and D f of all PIs increased linearly with respect to the relative humidity (RH) of the measurement environment, and their slopes (h Dk and h Df), i.e., the RH sensitivities of D k and D f, showed a proportional relationship with a high correlation coefficient (R 2 = 0.986). The weight fraction of polar imide and ester groups (Polar %) and the hydrophobicity of PIs, which are closely related to the fluorine content (F %), are essential factors in determining the values of D k, D f, h Dk, and h Df. These relationships are crucial for developing low-dielectric PI materials exhibiting low D k and D f values, as well as reduced sensitivity to humidity.

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“…Reducing the density or polarizability are two effective strategies for minimizing the D k of PIs. It was demonstrated that introducing bulky fluorinated substituents into the backbone can significantly reduce the D k of PIs due to the strong electronegativity and low atomic polarizability of fluorine [ 19 , 20 ]. In addition, the introduction of fluorine endows PIs with good organo-solubility and lowers water absorption [ 21 ].…”

Section: Introductionmentioning

confidence: 99%

Frequency-Dependent Dielectric Permittivity and Water Permeability in Ordered Mesoporous Silica-Grafted Fluorinated Polyimides

Son,

Park,

Kim

et al. 2024

Polymers

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Polymers with a low dielectric constant (Dk) are promising materials for high-speed communication networks, which demand exceptional thermal stability, ultralow Dk and dissipation factor, and minimum moisture absorption. In this paper, we prepared a series of novel low-Dk polyimide films containing an MCM-41-type amino-functionalized mesoporous silica (AMS) via in situ polymerization and subsequent thermal imidization and investigated their morphologies, thermal properties, frequency-dependent dielectric behaviors, and water permeabilities. Incorporating 6 wt.% AMS reduced the Dk at 1 MHz from 2.91 of the pristine fluorinated polyimide (FPI) to 2.67 of the AMS-grafted FPI (FPI-g-AMS), attributed to the free volume and low polarizability of fluorine moieties in the backbone and the incorporation of air voids within the mesoporous AMS particles. The FPI-g-AMS films presented a stable dissipation factor across a wide frequency range. Introducing a silane coupling agent increased the hydrophobicity of AMS surfaces, which inhibited the approaching of the water molecules, avoiding the hydrolysis of Si–O–Si bonds of the AMS pore walls. The increased tortuosity caused by the AMS particles also reduced water permeability. All the FPI-g-AMS films displayed excellent thermooxidative/thermomechanical stability, including a high 5% weight loss temperature (>531 °C), char residue at 800 °C (>51%), and glass transition temperature (>300 °C).

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Polyimides with low dielectric constants and dissipation factors at high frequency derived from novel aromatic diamines with bistrifluoromethyl pendant groups

Abstract: Fan-out Wafer-level Packaging (FOWLP) urgently demands low dielectric constant and dissipation factor interlayer dielectric materials to mitigate high transmission loss at high frequencies. Polyimides (PIs) are widely used as interlayer...

Cited by 8 publications

References 37 publications

Prediction and Interpretability Study of the Glass Transition Temperature of Polyimide Based on Machine Learning with Quantitative Structure–Property Relationship (T_g-QSPR)

Prediction and Interpretability Study of the Glass Transition Temperature of Polyimide Based on Machine Learning with Quantitative Structure–Property Relationship (T_g-QSPR)

Polarization Analysis and Humidity Dependence of Dielectric Properties of Aromatic and Semialicyclic Polyimides Measured at 10 GHz

Frequency-Dependent Dielectric Permittivity and Water Permeability in Ordered Mesoporous Silica-Grafted Fluorinated Polyimides

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Polyimides with low dielectric constants and dissipation factors at high frequency derived from novel aromatic diamines with bistrifluoromethyl pendant groups

Abstract: Fan-out Wafer-level Packaging (FOWLP) urgently demands low dielectric constant and dissipation factor interlayer dielectric materials to mitigate high transmission loss at high frequencies. Polyimides (PIs) are widely used as interlayer...

Cited by 8 publications

References 37 publications

Prediction and Interpretability Study of the Glass Transition Temperature of Polyimide Based on Machine Learning with Quantitative Structure–Property Relationship (Tg-QSPR)

Prediction and Interpretability Study of the Glass Transition Temperature of Polyimide Based on Machine Learning with Quantitative Structure–Property Relationship (Tg-QSPR)

Polarization Analysis and Humidity Dependence of Dielectric Properties of Aromatic and Semialicyclic Polyimides Measured at 10 GHz

Frequency-Dependent Dielectric Permittivity and Water Permeability in Ordered Mesoporous Silica-Grafted Fluorinated Polyimides

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Prediction and Interpretability Study of the Glass Transition Temperature of Polyimide Based on Machine Learning with Quantitative Structure–Property Relationship (T_g-QSPR)

Prediction and Interpretability Study of the Glass Transition Temperature of Polyimide Based on Machine Learning with Quantitative Structure–Property Relationship (T_g-QSPR)