2014
DOI: 10.1039/c4ta04663c
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Polyimide nanocomposites with boron nitride-coated multi-walled carbon nanotubes for enhanced thermal conductivity and electrical insulation

Abstract: Polyimide nanocomposites with boron nitride-coated multi-walled carbon nanotubes (BN-c-MWCNTs) were successfully prepared with enhanced thermal conductivity and electrical insulation.

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Cited by 138 publications
(70 citation statements)
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“…Although chemical functionalization of the CNTs improves the dispersion of CNTs, the covalent functionalization can also distort the structure of CNTs and thus sometimes even reducing the thermal conductivity [217]. Coating CNTs with inorganic materials such as BN or alumina has also been reported to significantly improve the dispersibility of CNTs [218][219][220]. The thermal conductivities of polyimide (PI) based nanocomposites incorporated with MWCNTs or BN-coated MWCNT (BN-c-MWCNTs) are compared, as shown in Fig.…”
Section: Improvement Of Filler Distributionmentioning
confidence: 99%
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“…Although chemical functionalization of the CNTs improves the dispersion of CNTs, the covalent functionalization can also distort the structure of CNTs and thus sometimes even reducing the thermal conductivity [217]. Coating CNTs with inorganic materials such as BN or alumina has also been reported to significantly improve the dispersibility of CNTs [218][219][220]. The thermal conductivities of polyimide (PI) based nanocomposites incorporated with MWCNTs or BN-coated MWCNT (BN-c-MWCNTs) are compared, as shown in Fig.…”
Section: Improvement Of Filler Distributionmentioning
confidence: 99%
“…The thermal conductivities of polyimide (PI) based nanocomposites incorporated with MWCNTs or BN-coated MWCNT (BN-c-MWCNTs) are compared, as shown in Fig. 21 [218]. The thermal conductivity of MWCNT@PI decreases with the increasing concentration of MWCNTs when its concentration is larger than 1 wt%, while the thermal conductivity of BN-c-MWCNT@PI keeps increasing with the increase of BN-c-MWCNT concentrations.…”
Section: Improvement Of Filler Distributionmentioning
confidence: 99%
“…Therefore, they are widely used in the electronics and aerospace industry as an insulating film due to their excellent thermal stability, mechanical properties, and low dielectric constants [1][2][3][4][5][6]. However, the PI has a thermal conductivity of the order of 0.1 W/(mK), which cannot meet the heat-dissipating requirements of microelectronic product.…”
Section: Introductionmentioning
confidence: 99%
“…Nowadays, with the development of science and technology, there are the increasing requirements for the thermal conductive polymer materials and parts in many fields such as electric and electronic field, semiconductor industry, and aerospace . As a result, more and more attention has been focused on the investigation of thermal conductive polymer composites such as polypropylene/aluminum nitride, polyimide/boron nitride (BN), poly(vinyl alcohol) (PVA)/graphite, and ABS/copper system because of their outstanding properties such as light weight and good formability. However, there are still some challenges in preparation of the current thermal conductive polymer composites and parts.…”
Section: Introductionmentioning
confidence: 99%