Plasma etching durability of poly(methyl methacrylate)

Harada, Katsumi

doi:10.1002/app.1981.070260620

Cited by 44 publications

(19 citation statements)

References 18 publications

(3 reference statements)

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“…Harada [91] reported activation energies for PMMA in 0 2 / C F 4 plasmas which varied with gas feed composition and rf power. The assumption is that the activation energy is not temperature dependent.…”

Section: Temperature Dependencementioning

confidence: 99%

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Plasma Etching of Organic Polymers

Egitto

1990

Plasma Deposition, Treatment, and Etching of Polymers

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Section: Temperature Dependencementioning

confidence: 99%

“…The activation energy of PMMA decreases for temperatures above the glass transition temperature, about 388 K [34,91]. This may be due to increased molecular mobility of polymers and increased probability of chemical reaction above T g [91].…”

Section: Plasma Etching Of Organic Polymersmentioning

confidence: 99%

Plasma Etching of Organic Polymers

Egitto

1990

Plasma Deposition, Treatment, and Etching of Polymers

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“…20 Since the bent point does not coincide with Tc of three homopolymers in Table IV, it is reasonable that the depropagation is not merely the depolymerization to form monomers. He speculated the bent point was a critical temperature and was associated with glass transition temperature at which molecular mobiliti of polymers abruptly increased.…”

Section: ) Temperature Dependence Of Dry Etching Ratementioning

confidence: 98%

“…20 If the thickness reduction is caused by the reaction occurring in the bulk of resist film, the thickness will not decrease linearly with an increase of the exposure time. As was observed with the UV light from the deuterium discharge lamp by the present authors, far UV light, which was emitted from the oxygen plasma, may also contribute to the thickness reduction.…”

Section: B Durability Against Oxygen Plasma 1) Measurement Of Dry Etmentioning

confidence: 99%

Performance Control of Positive-Working Electron Beam Resists by Copolymerization and Blending

Sugita

Ueno

Funabashi

et al. 1985

Polym J

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ABSTRACT:EB exposure characteristics, such as sensitivity and contrast, and durability against oxygen plasma were measured with linear copolymers and polymer blends of various composition, which were prepared from cx-methylstyrene [MSt] and methyl methacrylate [MMA]. Moreover, new developers were examined for these polymers, since sensitivity and contrast of the positive-working resist system depend largely on dissolution kinetics concerning each combination of the resist polymer and the developer. Methyl isobutyl ketone and isoamyl acetate were used as the developer, though they were developers of excessive dissolving power for PMMA and /or PMSt homopolymers. The copolymers containing 30-50mol% of MSt were as durable as PMSt homopolymer against oxygen plasma and had higher contrast than PMMA. The blend had dryetching durability as large as the copolymer of the same composition, and showed considerably high contrast, while the copolymer had higher sensitivity than the blend. The blends containing 21 mol% or Jess of MSt monomer units were much more durable than PMMA and of contrast as high as PMMA, but Jess sensitive than PMMA.KEY WORDS Sensitivity I Contrast I Durability I Oxygen Plasma I Dry Etching I cx-Methylstyrene I Methyl Methacrylate I Composition I Developer I As the dimensions of electronic devices shrink, the resists for microfabrication are required to have excellent performance such as i) higher contrast, ii) larger dry-etching durability, and iii) higher sensitivity. It is generally said from theoretical consideration and experimental results that positive-working resists are of high contrast. Recently, it has been found out that dry-etching durability and sensitivity are the two contradicting properties in positive-working electron resists; a durable resist such as poly(phenyl methacrylate)[PPhMA] has a low sensitivity, while a sensitive resist such as poly(butene-1 sulfone) [PBS] is not durable enough. 1 This tendency was derived from the study on one-component resist systems composed of degradable linear homopolymers, and does not deny the future development of excellent resist systems which have all the characteristics i), ii), and iii), if the candidates to be investigated are extended toward multi-component, crosslinked polymer, and /or copolymer systems. For example, PPhMA was sensitized by copolymerizing with a small amount of crosslinkable monomer at the slight expense of its large dry-etching durability. 2 The durability of poly( olefin sulfone) was extensively improved by blending with an aromatic resin at a great loss of high sensitivity, as was observed with the poly(2-methyl -1-pentene sulfone )-novo lac system. 3 Sensitivity of poly( methyl methacrylate) was enhanced by copolymerization with a fragile monomer, e.g., methyl chloroac-1091

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“…These radicals react with oxygen molecules from the plasma to form carbonyl and alcohol groups. [8][9][10][11][12][13][14][15] Two separate mechanisms can account for the observed maximum. The desorption of these volatile products requires sufficient energy that must be provided by either ion bombardment or sample heating.…”

Section: Introductionmentioning

confidence: 99%