Anti-Abrasive Nanocoatings 2015
DOI: 10.1016/b978-0-85709-211-3.00018-2
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Plasma-assisted techniques for growing hard nanostructured coatings

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Cited by 12 publications
(10 citation statements)
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“…Different surface engineering technologies, particularly coating processing options, such as electroplating and electroless technologies, thermal spray, microwave cladding, friction stir processing, plasma‐assisting technology, PVD, CVD, and some others can be basically considered and employed for steel protection by hard layers. Ceramic (oxide and non‐oxide) or composite protective layers (e.g., CMC, MMC, and DLC) have higher potential 124–136 . However, many of the listed options are not well suited for industrial applications in mining and mineral processing, either because they cannot withstand severe abrasive and erosive conditions required by the industry, or because they are not applicable for the inner surface protection of long tubing and complex shape components.…”
Section: Major Advanced Ceramic Composite or Coating Materials For Pr...mentioning
confidence: 99%
“…Different surface engineering technologies, particularly coating processing options, such as electroplating and electroless technologies, thermal spray, microwave cladding, friction stir processing, plasma‐assisting technology, PVD, CVD, and some others can be basically considered and employed for steel protection by hard layers. Ceramic (oxide and non‐oxide) or composite protective layers (e.g., CMC, MMC, and DLC) have higher potential 124–136 . However, many of the listed options are not well suited for industrial applications in mining and mineral processing, either because they cannot withstand severe abrasive and erosive conditions required by the industry, or because they are not applicable for the inner surface protection of long tubing and complex shape components.…”
Section: Major Advanced Ceramic Composite or Coating Materials For Pr...mentioning
confidence: 99%
“…In PECVD of SiC films, methane (CH 4 ) and silane (SiH 4 ) are commonly used as carbon and silicon precursors, respectively [ 80 ]. In addition, the synthesis of PECVD SiC films using a single precursor, such as DSB, methylsilane, MTS, or HMDS, have also been reported [ 26 , 81 , 82 , 83 ]. Due to the importance of SiC produced by PECVD, a recent theoretical study discussed the reaction of various silicon and carbon precursors with bare 3C-SiC (011) surfaces (where silicon and carbon atoms are exposed) and H-terminated 3C-SiC (011) surfaces and how silane plasma fragments react with H-Si and H-C bonds of the H-terminated 3C-SiC (011) surfaces [ 84 ].…”
Section: Chemical Vapor Synthesis Of Sic Films: From Cvd To Aldmentioning
confidence: 99%
“…In this context, extensive research has been done on growth of SiC-based films at low- or high-temperature CVD processes aiming to produce high-quality films for application not only in the field of MEMS, but also for hard coatings [ 83 ], biotechnology [ 117 ], chemical sensors [ 116 ], and other electronic applications. At high-temperature CVD processes (>500 °C [ 8 ]), we can cite the APCVD, LPCVD, and MOCVD methods.…”
Section: Cvd-based Sic Requirements For Development Of Mems/nems Dmentioning
confidence: 99%
“…-High-purity sources can be used. The three most common PVD coating approaches, where (a) shows a vacuum deposition process [158], (b) illustrates a schematic drawing of the ion-plating method [159], and (c) demonstrates the physical sputtering processes [160]. Reproduced with permission from [160].…”
Section: Vacuum Depositionmentioning
confidence: 99%