Physical properties of epoxy molding compound for semiconductor encapsulation according to the coupling treatment process change of silica

Kim, Whan Gun; Ryu, Je Hong

doi:10.1002/(sici)1097-4628(19970906)65:10<1975::aid-app15>3.3.co;2-0

Cited by 1 publication

(2 citation statements)

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“…Delamination can be initiated by a number of factors, one of which is a CTE mismatch between EMC and the die‐pad 5–7. Therefore, considerable research efforts have been devoted to the reduction of CTE mismatch by new resin synthesis,8–10 high filler loading,11, 12 or surface modification of fillers for enhanced adhesion to the base resin 13–15…”

Section: Introductionmentioning

confidence: 99%

“…Among these approaches, the surface modification of silica fillers with silane coupling agents has been extensively investigated because silane coupling agents are known to promote chemical bonds between silica fillers and epoxy resin, thus providing excellent adhesion between them 16–18. In fact, use of silane coupling agents has been quite successful in enhancing the adhesion of silica fillers to epoxy resin, with the result that three methods have been introduced 14, 15. The best adhesion is rendered by the solution method despite the coagulation problem of silica fillers, which require a powdering process, whereas internal pretreatment and integral addition methods provide inferior adhesion compared to the solution method but without the coagulation problem.…”

Section: Introductionmentioning

confidence: 99%

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DSC analysis of epoxy molding compound with plasma polymer–coated silica fillers

Roh

Lee

Kim

et al. 2003

J of Applied Polymer Sci

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Silica fillers were modified by plasma-polymerization coating of 1,3-diaminopropane, allylamine, pyrrole, 1,2-epoxy-5-hexene, allylmercaptan, and allylalcohol using RF plasma (13.56 MHz). Modified fillers were then mixed with biphenyl epoxy resin, phenol novolac (curing agent), and optionally triphenylphosphine (catalyst) to prepare samples for DSC analyses. Some samples were also prepared from uncoated silica fillers and monomers used in plasma polymerization coating, instead of plasma polymercoated silica fillers. Plasma polymer-coated silica fillers were characterized by FTIR, XPS, and water contact angle measurements. In DSC analyses, all samples with plasma polymer-coated silica fillers showed a large peak and an additional one or two small exothermic peaks when catalyst was added, compared to only one large peak with as-received silica fillers. The large peak could be from epoxyphenol novolac reaction in the presence of catalyst, whereas small reaction peaks were attributed to the chemical reaction between epoxy resin and functional moieties in the plasma polymer coating, such as amine, OH, and/or SH groups, as evidenced by FTIR and XPS analysis and contact angle measurements.

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