Photo-reaction of ionic bonding photosensitive polyimide.

Tomikawa, Masao; Asano, Masaya; Ohbayashi, Gentaro; Hiramoto, Hiroo; Morishima, Youtaro; Kamachi, Mikiharu

doi:10.2494/photopolymer.5.343

Cited by 18 publications

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“…Masao Tomikawa has studied the chemistry and applications of the photo-definable polyimide for long time. One of his important contributions for photo-definable polyimides is a study of the initialphoto reaction of the ionic-bonded-photo-definable polyimide [1], where he showed that the initial reaction is the photo-induced-charge separation in a poly(amic acid) (PAA) chain but the acrylic group in the photo reactive amine did not react mainly. This means that the photo reaction of the ionicbonded-photo-definable polyimide is related to the charge-transfer-complex formation in poly(amic acid).…”

Section: Masao Tomikawamentioning

confidence: 99%

The Photopolymer Science and Technology Award

Tomikawa

2020

J. Photopol. Sci. Technol.

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The Photopolymer Science and Technology Award No. 201100, the Outstanding Achievement Award 2020 was presented to Dr. Masao Tomikawa for his outstanding achievements in photo definable polyimides science and technology including the photo reaction mechanism of the Ionic-bonded-photosensitive polyimide, and the pioneering development of positive photo definable polyimide by partial esterification of poly(amic acid) for semiconductor stress buffer and for the organic light emitting diode (OLED) displays. In addition, he contributed the Cu compatibility study for the improvement to long time reliability of the polyimide and Cu interconnection.

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Section: Masao Tomikawamentioning

confidence: 99%

The Photopolymer Science and Technology Award

Tomikawa

2020

J. Photopol. Sci. Technol.

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“…In order to ensure an economical and reproducible method of preparation, the new photoreactive polyimide precursor was confirmed to utilize commercial methods of photoresist process and technology [10,11].…”

Section: Reaction Mechanism Of Photo-induced Charge Separation In Ionmentioning

confidence: 99%

“…From the experimental evidence, a new photoreaction mechanism of ionic-bonded photosensitive polyimide is presented in this study by means of UV-Vis spectroscopy, NMR (nuclear magnetic resonance) spectroscopy, ESR (electron spin resonance) spectroscopy, time-resolved spectroscopy, and other qualitative measurements [10,11,15]. …”

Section: Reaction Mechanism Of Photo-induced Charge Separation In Ionmentioning

confidence: 99%

“…The transient spectrum was obtained using a nanosecond, time-resolved system, consisting of a YAG-laser, third harmonic generator, monochrometer, photomultiamplifier, digital memory, digital storage scope and a personal computer [10,11,15].…”

Section: Time-resolved Spectroscopymentioning

confidence: 99%

“…A new photo-induced polymerization mechanism of ion-radical reaction path of photoresist of polyimides is proposed [10,11]. It is based on flash photolysis, analysis of both transient spectra and electron spin resonance spectra.…”

Section: High-performance Photoresist Of Polyimide: Proposal Of New Pmentioning

confidence: 99%

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Recent Development of Advanced Functional Polymers for Semiconductor Encapsulants of Integrated Circuit Chips and High-temperature Photoresist for Electronic Applications

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Development and commercialization of ionic‐type photosensitive polyimides

Asano

Eguchi

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et al. 1993

Polymers for Advanced Techs

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Toray's ionic-type photosensitive polyimide, "Photoneece", is widely used as an interdielectric and as a protection layer for microelectronics, because of its properties, such as the removal of photoreactive groups at low temperature, excellent thermal, mechanical and electrical film properties and excellent adhesion to various substrates. Toray has developed a new type of "Photoneece", UR-5100, which is a low-stress photosensitive polyimide. In addition to a low thermal expansion coefficient (25 ppm/"C), "Photoneece" UR-5100 also features high resolution with an aspect ratio of more than 2.0 in 40 p m imaged film, and excellent mechanical properties in the cured film such as high elongation (>20%) and tensile strength 0 2 0 0 MPa), even after 60 hr heat treatment at 350°C. "Photoneece" UR-5100 can be applied in multichip modules (MCMs), hybrid circuits, ICs and LSls. In this paper the characterization and processing of this "Photoneece" UR-5100 are described.

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Photo-reaction of ionic bonding photosensitive polyimide.

Cited by 18 publications

References 1 publication

The Photopolymer Science and Technology Award

The Photopolymer Science and Technology Award

Recent Development of Advanced Functional Polymers for Semiconductor Encapsulants of Integrated Circuit Chips and High-temperature Photoresist for Electronic Applications

Development and commercialization of ionic‐type photosensitive polyimides

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