2014
DOI: 10.3390/s150100672
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Performance Comparison of Cross-Like Hall Plates with Different Covering Layers

Abstract: This paper studies the effects of the covering layers on the performance of a cross-like Hall plate. Three different structures of a cross-like Hall plate in various sizes are designed and analyzed. The Hall plate sensitivity and offset are characterized using a self-built measurement system. The effect of the P-type region over the active area on the current-related sensitivity is studied for different Hall plate designs. In addition, the correlation between the P-type covering layer and offset is analyzed. T… Show more

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Cited by 16 publications
(14 citation statements)
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“…From the results of a recent paper [ 20 ], the P-type covering layer benefits the current-related sensitivity, because of the decreased thickness of the active region, so in the aspect of the current-related sensitivity, the aluminum covering is not a recommendable method to reduce the flicker noise and to improve the stability of a Hall sensor.…”
Section: Resultsmentioning
confidence: 99%
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“…From the results of a recent paper [ 20 ], the P-type covering layer benefits the current-related sensitivity, because of the decreased thickness of the active region, so in the aspect of the current-related sensitivity, the aluminum covering is not a recommendable method to reduce the flicker noise and to improve the stability of a Hall sensor.…”
Section: Resultsmentioning
confidence: 99%
“…It is obvious that the aluminum layer leads to a additional depletion region, which will increase the offset voltage, so S1 and S2 without covering aluminum are much better than S3 and S4 in the offset voltage aspect. In the method mentioned in [ 20 ], a P-type layer is formed above the N-type region. Therefore, one more process with the mask misalignment is necessary in the active region.…”
Section: Resultsmentioning
confidence: 99%
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“…where is the current related sensitivity. can be calculated from Hall coefficient, , as ≜ − 1 (Xu et al, 2011;Popovic, 2004;Lyu et al, 2015;Boero et. al., 2003).…”
Section: Device Fabrication and Characterizationmentioning
confidence: 99%