2001
DOI: 10.1116/1.1417543
|View full text |Cite
|
Sign up to set email alerts
|

Patterning nonflat substrates with a low pressure, room temperature, imprint lithography process

Abstract: Step and flash imprint lithography (SFIL) is a technique that has the potential to replace photolithography for patterning resist with sub-100 nm features. SFIL is a low cost, high throughput alternative to conventional photolithography for high-resolution patterning. It is a molding process in which the topography of a template defines the patterns created on a substrate. The ultimate resolution of replication by imprint lithography is unknown but, to date, it has only been limited by the size of the structur… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
47
0

Year Published

2003
2003
2015
2015

Publication Types

Select...
9

Relationship

0
9

Authors

Journals

citations
Cited by 60 publications
(47 citation statements)
references
References 10 publications
0
47
0
Order By: Relevance
“…5), which are highly crystalline and have low solubility; APTMS (Fig. 5), which is a commonly used monomer to increase etch resistance to oxygen plasma etches40 but suffers from severe dewetting during spin‐coating; and 2,5‐dimethyl‐2,5‐hexanediol dimethacrylate (DHDMA) (Fig. 5), which is an acid cleavable crosslinker that demonstrates retention of functionality after hyperbranched polymer formation.…”
Section: Resultsmentioning
confidence: 99%
“…5), which are highly crystalline and have low solubility; APTMS (Fig. 5), which is a commonly used monomer to increase etch resistance to oxygen plasma etches40 but suffers from severe dewetting during spin‐coating; and 2,5‐dimethyl‐2,5‐hexanediol dimethacrylate (DHDMA) (Fig. 5), which is an acid cleavable crosslinker that demonstrates retention of functionality after hyperbranched polymer formation.…”
Section: Resultsmentioning
confidence: 99%
“…In many occasions, imprint processes need to be undertaken at temperatures above the glass transition temperature T g of the resist [116][117][118]. Frequently, this temperature is well above 100°C.…”
Section: Distortion Of Pattern Placement In Thermal Nilmentioning
confidence: 98%
“…The nanoimprinted resist is then typically used as an etch mask to transfer the pattern to the underlying substrate or film. One variation of this process, known as ''step and flash'', is outlined in [23] and shown in Fig. 5.…”
Section: Lithography and Fabricationmentioning
confidence: 99%