Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package

Hsu, Hsiang-Chen; Yu, Shen-Wen; Hsu, Yu-Teng; Chang, Wei-Yaw; Lin, Ming-Jer; Lin, Ruei-Ming; Chin, Pei-Chieh; Ho, Hung-Chun; Lu, Ming-Cheng; Lee, Cheng-Tung; Chen, Chin-Liang; Liao, Chien‐Hung; Huang, Yu-Jung; Fu, Shen–Li; Chen, Lishan

doi:10.1109/icept.2006.359731

Cited by 3 publications

(3 citation statements)

References 2 publications

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“…There have been many 3-D stack die packaging structures reported [2][3] in the past decade. Among these, the multiple layers pyramid stack die and overhand staggered stack die PBGA packages showed in Figure 1 and Figure 2, respectively, were developed for its easily compliance with the current manufacturing process.…”

Section: Introductionmentioning

confidence: 99%

Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique

Hsu

Lee

et al. 2006

2006 International Conference on Electronic Materials and Packaging

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The objective of this research is to investigate the effects of board-level drop test based on the support excitation scheme incorporated with the submodel technique for stacked-die packages. Three lead-free materials, namely SAC405 (Sn4AgO.5Cu), SAC387(Sn3.8AgO.7Cu) and Sn3.5Ag were used to demonstrate the transient dynamic response for solder balls subject to JEDEC pulse-controlled board-level drop test standard JESD22-B Ii OA Condition B[1]. The support excitation scheme was developed and applied to examine the transient dynamic response for it produces no rigid-body motion to the test vehicle and dramatically reduces the computational cost. In order to evaluate the structure of the interested area, a strip model sliced from the full test vehicle is used in this research. In addition, the submodel region is particularly chosen with strip model by performing the cut boundary interpolation. The envelope of equivalent stress for the outermost solder joint off the end of the strip model is plot to show the potential solder failure mode and mechanism. The cut boundary of submodel is verified and the mesh density of submodel is examined. For a refinery mesh of submodel, parametric studies are carried out to study the reliability of the outermost solder joint, and the results are summarized as design rules for the development of stacked-die packages.

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Section: Introductionmentioning

confidence: 99%

Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique

Hsu

Lee

et al. 2006

2006 International Conference on Electronic Materials and Packaging

Self Cite

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“…Failure mechanisms are usually localized in the silicon die and in wires because of either material or geometry dependency. A [4] finer mesh is therefore applied in the wire bond interconnect where interfaces, geometrical singularities and curvature areas usually exhibit higher stress field.…”

Section: Modelling Detailsmentioning

confidence: 99%

“…FEM simulations have been popularly used to analyze reliability effects of various design parameters and to validate best suited design scenarios for new products [4][5][6][7]. A package-dimensioned model and a wired-interconnect-centered model previously developed will be used in this paper to assess stress distribution with a limited computation time and an acceptable error range [8,9].…”

Section: Introductionmentioning

confidence: 99%

RFID tags for cryogenic applications: Experimental and numerical analysis of thermo-mechanical behaviour

Cauchois

Yin

Gouantes

et al. 2013

Microelectronics Reliability

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Abstract:RFID solutions will improve the traceability of biological samples stored at low temperature (77K) in biobanks. To achieve this goal, the reliability of RFID tags is essential. In this paper, we focus on the reliability aspect of RFID tags in harsh environment and more specifically to assembly design optimization through numerical simulations and accelerated life tests. A packagedimensioned model and a wire-interconnect centered model have been used to assess stress distribution in the package and wire bonds. We also develop a specific versatile test bench to apply thermal cycling while monitoring the functionality of the tags. We investigate 3 different tag configurations and demonstrate that the main failure mode is related to wire breaks. The occurrence of this failure depends mainly on the nature and thickness of the encapsulant resin which induce compressive and tensile stresses during thermal cycling. FEM results are in good agreement with observed failures.

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Application of submodeling technique to transient drop impact analysis of board-level stacked die packages

Hsu

Lee

et al. 2006

2006 8th Electronics Packaging Technology Conference

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Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package

Cited by 3 publications

References 2 publications

Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique

Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique

RFID tags for cryogenic applications: Experimental and numerical analysis of thermo-mechanical behaviour

Application of submodeling technique to transient drop impact analysis of board-level stacked die packages

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