Parametric numerical study of the flow and heat transfer in microchannel with dimples

Xu, Minghai; Lu, Hui; Gong, Liang; Chai, John C.; Duan, Xiaoyang

doi:10.1016/j.icheatmasstransfer.2016.06.002

Cited by 96 publications

(14 citation statements)

References 32 publications

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“…The effect of increased mean velocity studied by Lan et al [102] and Li et al [93,103] exhibited limiting streamline patterns similar to that reported by Xu et al [101]. It was evident [102,103] that dimple-protrusion combination on opposite side walls would result in higher TEF than dimples on only one side wall.…”

Section: Dimples and Protrusionssupporting

confidence: 78%

“…Xu et al [101] predicted only 15% increase in Nu and 2% drop in f together contributing to 16% increase in TEF. The optimal setting of the channel aspect ratio, the radius, depth and spacing of the dimples were obtained as 4, 0.2 mm, 0.1 mm and 0.7 mm, respectively for the centres of the first and last dimples located 2 mm and 16 mm away from the inlet, respectively.…”

Section: Dimples and Protrusionsmentioning

confidence: 94%

“…On the basis of three-dimensional streamline plots, Xu et al [101] concluded the effects of increased channel aspect ratio from 1 and the dimple depth to be similar. For low value of either of the parameters, recirculation bubble remains confined in the bottom part of a dimple.…”

Section: Dimples and Protrusionsmentioning

confidence: 99%

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A review of liquid flow and heat transfer in microchannels with emphasis to electronic cooling

2019

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Since the realization of microchannel devices more than three and half decades ago with water as the cooling fluid providing heat transfer enhancement, significant progress has been made to improve the cooling performance. Thermal management for electronic devices with their ever-widening user profile remains the major driving force for performance improvement in terms of miniaturisation, long-term reliability, and ease of maintenance. The ever-increasing requirement of meeting higher heat flux density in more compact and powerful electronic systems calls for further innovative solutions. Some recent studies indicate the promise offered by processes with phase change and the use of active devices. But their adoption for electronic cooling still weighs unfavourably against long-term fluid stability and simplicity of device profile with moderate to high heat transfer capability. Applications and reviews of these promising research trends have been briefly visited in this work. The main focus of this review is the flow and heat transfer regime related to electronic cooling in evolving channel forms, whose fabrication are being enabled by the significant advancement in micro-technologies. Use of disruptive wall structures like ribs, cavities, dimples, protrusions, secondary channels and other interrupts along with smooth-walled channels with curved flow passages remain the two chief geometrical innovations envisaged for these applications. These innovations target higher thermal enhancement factor since this implies more heat transfer capability for the same pumping power in comparison with the corresponding straight-axis, smooth-wall channel configuration. The sophistication necessary to deal with the experimental uncertainties associated with the micron-level characteristic length scale of any microchannel device delayed the availability of results that exhibited acceptable matching with numerical investigations. It is indeed encouraging that the experimental results pertaining to simple smooth channels to grooved, ribbed and curved microchannels without unreasonable increase in pumping power have shown good agreement with conventional numerical analyses based on laminar-flow conjugate heat-transfer model with no-slip boundary condition. The flow mechanism with the different disruptive structures like dimple, cavity and rib, fin and interruption, vortex generator, convergingdiverging side walls or curved axis are reviewed to augment the heat transfer. While the disruptions cause heat transfer enhancement by interrupting the boundary layer growth and promoting mixing by the shed vortices or secondary channel flow, the flow curvature brings in enhancement by the formation of secondary rolls culminating into chaotic advection at higher Reynolds number. Besides these revelations, the numerical studies helped in identifying the parameter ranges, promoting a particular enhancement mechanism. Also, the use of modern tools like Poincare section and the analysis of flow bifurcation leading to chaotic advection is discussed....

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Section: Dimples and Protrusionssupporting

confidence: 78%

Section: Dimples and Protrusionsmentioning

confidence: 94%

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A review of liquid flow and heat transfer in microchannels with emphasis to electronic cooling

2019

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“…В последнее десятилетие усилился интерес к микроканалам [4][5][6], в которых увеличение теплоотдачи вызывается расположением на стенке однорядного пакета сферических лунок. Однако сферические лунки не являются эффективными интенсифика-торами, хотя при низких числах Рейнольдса Re отмечается снижение гидравлических потерь в облуненном канале (dimpled channel) по сравнению с таковыми для гладкого плоскопараллельного аналога.…”

Section: поступило в редакцию 3 октября 2017 гunclassified

Интенсификация Ламинарного Течения В Узком Микроканале С Однорядными Наклоненными Овально-Траншейными Лунками

Исаев¹,

Баранов²,

Леонтьев³

et al. 2018

Письма В Журнал Технической Физики

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A fully developed laminar air flow in a plane-parallel channel of width 6 and height 1 with single-row inclined oval-trench dimples on the walls are calculated using multiblock computing technologies at Re = 10^3. A periodic channel section of length 4 with one dimple of length 4.5, width 1, an angle of inclination to the flow of 45°, and a depth varying from 0 to 0.375 is considered. Intensification of a laminar flow in the flow core in a channel supplied with trench dimples of depth more than 0.25, such that the maximum velocity is 1.5 times higher than the maximum flow velocity in a smooth channel, is found.

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“…To enhance the heat transfer performance, a great number of efforts have been devoted to reducing thermal resistance of microchannel heat sink, such as surface modification [5,6]; increasing the heat transfer capacity of solid materials or coolant, e.g. high thermal conductivity solid materials [7] or nanofluids [8,9]; or novel designs, e.g., inserting solid ribs, porous blocks or baffles into the channel [10][11][12][13][14][15], or using wavy channels [16][17][18][19][20].…”

Section: Introductionmentioning

confidence: 99%

A new scheme for reducing pressure drop and thermal resistance simultaneously in microchannel heat sinks with wavy porous fins

Zhao

Lin

et al. 2017

International Journal of Heat and Mass Transfer

112

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Parametric numerical study of the flow and heat transfer in microchannel with dimples

Cited by 96 publications

References 32 publications

A review of liquid flow and heat transfer in microchannels with emphasis to electronic cooling

A review of liquid flow and heat transfer in microchannels with emphasis to electronic cooling

Интенсификация Ламинарного Течения В Узком Микроканале С Однорядными Наклоненными Овально-Траншейными Лунками

A new scheme for reducing pressure drop and thermal resistance simultaneously in microchannel heat sinks with wavy porous fins

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