Oxide films on sputtered tin-nickel alloy exposed to pure oxygen and air

Sharma, Sachin; Thomas, Jürgen

doi:10.1021/ac50015a030

Cited by 14 publications

(7 citation statements)

References 26 publications

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Section: Discussionmentioning

confidence: 78%

“…From the above discussion it is evident that caution must be used when interpreting results of cleaned surfaces as compared to electroplated and air-formed surfaces, as has been reported by others (18). Sharma and Tl~omas (18) have reported that sputtering of the surface and later exposure to air and O3 does not reproduce the native surface films.…”

Section: Discussionmentioning

confidence: 88%

“…Electroplated SnNi samples were prepared at two separate times. Both sets of samples were plated in a conventional fluoride bath (18) with the current density (20 mA/cm~), bath temperature (75~ time and bath pH monitored and controlled. One set of samples was plated on stainless steel strips (SnNi/SS) which yielded chips (~15 mm 2) of SnNi when a bending (14) stress was applied to the plated stainless steel.…”

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confidence: 99%

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Analysis of SnNi Electroplate by Secondary Ion Mass Spectrometry, Ion Scattering Spectrometry, and Rutherford Backscattering

Schubert¹

1978

J. Electrochem. Soc.

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Two batches of SnNi electroplate, expected to be composed of equal atomic amounts of Sn and Ni, have been examined by secondary ion mass spectrometry, ion scattering spectrometry, and Rutherford backscattering. Tin oxides and hydroxides were found in the surface region, which is Sn-rich; no Ni oxides or hydroxides were seen. The Sn/Ni ratio for the two batches was 45/55 and 52/48 a/o. After Ar+-sputter cleaning, films of the type which occur during and immediately after electroplating could not be reproduced in 10 .8 Torr O3. The regenerated films contained substantial amounts of nickel oxides and hydroxides.Electroplated metastable SnNi is of technological interest for a broad range of metallic coating applications. It is suitable as a decorative coating and as a protective corrosion barrier (1). Usage as one of the electroplated components of electrical components has also been proposed (2). Its main attractive feature is that surface films on electroplated SnNi form rapidly in air or most aqueous solutions and exhibit a high degree of passivity to further corrosion (3-5). In order to understand the nature of these films, a detailed analysis is important.With reasonable care during electroplating, the deposit is expected to have equiatomic composition (3), although a broad range of compositions can be plated (6). Current knowledge of the surface film composition has been obtained through Auger electron spectroscopy (AES), electron spectroscopy for chemical analysis (ESCA), and passivation potential curves. AES studies show the surface to be a tin-rich oxide (7) or a nickel polystannate (8). These two results are not in conflict since AES does not detect hydrogen nor chemical bonding in general. The ESCA study has reached a similar conclusion (9). Passivation-potential techniques indicate that the surface is nickel stannate (3, 4), however, with films that are only tens of angstroms thick (7,9), electrochemical techniques are not sufficient to give an unambiguous analysis. This paper describes the surface analysis of SnNi electroplate by three techniques; Rutherford backscattering (RBS), ion-scattering spectrometry (ISS), and secondary ion mass spectrometry (SIMS). ExperimentalThe SIMS experiments were carried out in a stainless steel ion pumped UHV system. These included molecular composition depth profiles and film regeneration with 02 exposure. A 2 keV focused Ar + ion source with variable current density has been de-

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Section: Discussionmentioning

confidence: 78%

Section: Discussionmentioning

confidence: 88%

mentioning

confidence: 99%

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Analysis of SnNi Electroplate by Secondary Ion Mass Spectrometry, Ion Scattering Spectrometry, and Rutherford Backscattering

Schubert¹

1978

J. Electrochem. Soc.

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“…These peaks belonged to Sn 4+ , Sn 2+ , and Sn, respectively. [13][14][15][16][17] From the raising intensity of the shoulder with sputtering, it could be said that there was an apparent increase in the concentration of Sn 2+ at the expense of Sn 4+ in the film as the film was sputtered ( Figure 4[b]). The question arose as to whether Sn 4+ was reduced to Sn 2+ during sputtering.…”

Section: Corrosion-october 1997mentioning

confidence: 99%

X-Ray Photoelectron Spectroscopic Study of the Oxide Film on an Aluminum-Tin Alloy in 3.5% Sodium Chloride Solution

Venugopal¹,

Veluchamy²,

Selvam³

et al. 1997

CORROSION

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Oxide films on Al and an Al-Sn alloy were analyzed by x-ray photoelectron spectroscopy (XPS) after immersion in 3.5% sodium chloride (NaCl) solution. Results showed Sn exhibited both Sn 2+ and Sn 4+ oxidation states in the oxide film. It was proposed that incorporation of these cations in the film would result in generation of more anionic and cationic vacancies in aluminum oxide (Al 2 O 3 ), leading to active dissolution of Al.

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“…[19]. The passivation of nickel-tin films has been the subject of many investigations because of its relevance to gold plated electrical contacts [27]. It was observed that a nickel-stannate together with SnO 2 layer is formed as nickel-tin film exposed to oxygen.…”

Section: Introductionmentioning

confidence: 99%

Investigations on Sn-doped Ni oxide thin films and their use as optical sensor devices

Dakhel

2012

Journal of Non-Crystalline Solids

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Oxide films on sputtered tin-nickel alloy exposed to pure oxygen and air

Cited by 14 publications

References 26 publications

Analysis of SnNi Electroplate by Secondary Ion Mass Spectrometry, Ion Scattering Spectrometry, and Rutherford Backscattering

Analysis of SnNi Electroplate by Secondary Ion Mass Spectrometry, Ion Scattering Spectrometry, and Rutherford Backscattering

X-Ray Photoelectron Spectroscopic Study of the Oxide Film on an Aluminum-Tin Alloy in 3.5% Sodium Chloride Solution

Investigations on Sn-doped Ni oxide thin films and their use as optical sensor devices

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