Oxidation of copper at high temperatures

Mrowec, S.; Stokłosa, Andrzej

doi:10.1007/bf00603530

Cited by 113 publications

(78 citation statements)

References 30 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Cu 3 N, if it is present in the powders, decomposes at *300°C [35,36]. In addition, Cu 2 O is stable and will not decompose to Cu up to a temperature of 1000°C [33,34]. Furthermore, decomposition of Cu(NO 3 ) 2 , if it is present in the powders, takes place below 300°C [37] [38][39][40].…”

Section: Resultsmentioning

confidence: 99%

“…The oxidation products of Cu in the air at room temperature include Cu 2 O and CuO [31,32]. CuO is decomposed to Cu 2 O at different temperatures under different O 2 pressures, and when the O 2 pressure is *10 -2 Pa, the decomposition temperature of CuO is *520°C [33,34], which is in agreement with the release of O 2 at *530°C during TGA-MS measurement (the thermogravimetric analyzer can be evacuated down to 10 -2 Pa). Notably, there is a sharp peak at *720°C in the ion current curves of 14, 28, 16, and 46, indicating simultaneous release of N 2 , O 2 , and NO 2 from the powders at this temperature.…”

Section: Resultsmentioning

confidence: 99%

See 1 more Smart Citation

The influence of oxygen and nitrogen contamination on the densification behavior of cryomilled copper powders during spark plasma sintering

et al. 2010

View full text Add to dashboard Cite

It has been found difficult to fully densify some mechanically milled pure metal powders by spark plasma sintering (SPS). In this study, the densification behavior of cryomilled, nanostructured (NS) Cu powders during SPS was related to changes to the chemistry of the powders. The results showed that the presence of very small amounts of O and N in the powders, which were introduced during cryomilling and handling, significantly influenced the densification response. Moreover, reduction/removal of O/N via thermal annealing of the powders before SPS led to complete densification of the powders during subsequent SPS. The mechanisms responsible for this behavior were ascertained: O and N existed in the cryomilled powders in the form of thermally unstable compounds, and the subsequent thermal decomposition of these compounds during SPS generated the gaseous species, leading to porosity formation and incomplete densification; annealing of the powders before SPS removed the gases which resulted from thermal decomposition, thereby facilitating complete consolidation during subsequent SPS.

show abstract

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

The influence of oxygen and nitrogen contamination on the densification behavior of cryomilled copper powders during spark plasma sintering

et al. 2010

View full text Add to dashboard Cite

show abstract

“…The oxidation behavior of copper has therefore received considerable interest for a very long time [1][2][3] . At temperatures above 600 °C, it is believed that the oxidation is controlled by the lattice diffusion of copper ions through a Cu 2 O layer [4][5][6] . In contrast, the reported kinetic data on the oxidation below 500 °C varied significantly 7 .…”

Section: Introductionmentioning

confidence: 99%

Oxidation Behavior of Copper at a Temperature below 300 °C and the Methodology for Passivation

2016

View full text Add to dashboard Cite

In this study, we investigate the oxidation behavior of copper at temperatures below 300 °C and its mechanism. A methodology to slow down the oxidation rate is then proposed based on the observed mechanism. The oxides formed after oxidation at low temperatures have fine crystal sizes; the rate constants reach 2×10 -15 m 2 /s and 6×10 -14 m 2 /s at 200 °C and 300 °C, respectively. A passivation treatment at 600 °C in nitrogen produces a thin oxide layer composed of relatively large Cu 2 O crystals. The presence of such a layer slows down the oxidation rate constants by an order of magnitude. This study demonstrates that the oxidation of copper at low temperatures is controlled by the grain boundary diffusion. Increasing the crystal size in the surface oxide reduces the oxidation rate significantly.

show abstract

“…The copper-oxygen system was selected since the kinetics of copper oxidation have recently been studied in detail by the gravimetric method using an ultra-sensitive vacuum microbalance [4]. Since these studies were performed in our laboratory it was possible to carry out the check experiments using the same material (spectrally pure copper, JohnsonMatthey product).…”

Section: Results Of Measurements Of the Kinetics Of Copper Oxidationmentioning

confidence: 99%

A manostat volumetric apparatus for studies on the kinetics of high-temperature reactions in solid-gas systems

Mrowec

Lason

Fryt

et al. 1974

Journal of Thermal Analysis

Self Cite

View full text Add to dashboard Cite

A new volumetric apparatus is described for continuous measurement of the kinetics of the oxidation of metals at high temperatures, and for measurement of adsorption and chemisorption of gases on solids. The measurement of the kinetics of oxygen fixation is performed automatically with very high precision. The oxidation of copper has been used to test the performance of the apparatus.Studies on the mechanisms of reactions in solid-gas systems, which include such processes as the thermal decomposition of solids and oxidation of metals and alloys, require the use of increasingly accurate methods of measurement [1,2].Kinetic measurements pray an essential role in these studies. In the case of oxidation processes, for instance, these measurements at various temperatures and pressures of the oxidizing medium provide valuable information about elementary processes which, under the given conditions, control the rate of the overall reaction. In many cases they allow calculations to be made of the defect concentration and self-diffusion coefficient of a metal or an oxidant in the solid product of oxidation of a metal or an alloy.Of the numerous methods used for studying the kinetics of the processes under discussion, two basic methods may be distinguished: a gravimetric and a volumetric method, which provide the most accurate results.In the present paper a new volumetric apparatus is described which makes it possible to obtain very accurate values of the rate constants of reactions in the given temperature and oxygen pressure ranges. Description of the apparatusDue to application of a new system of manostats, the apparatus to be described enables measurements of the volume of gas consumed by a sample under isothermal-isobaric conditions to be made with high precision. All operations involved in the measurement of the reaction kinetics, with the exception of the reading of a mercury level in the measurement burette, are automatic. The range of pressures of the apparatus used in the present work was 2-600 mm Hg. It will be possible in the future to extend this range by modifying the apparatus. The work on such a modification is now in progress.

show abstract

Oxidation of copper at high temperatures

Cited by 113 publications

References 30 publications

The influence of oxygen and nitrogen contamination on the densification behavior of cryomilled copper powders during spark plasma sintering

The influence of oxygen and nitrogen contamination on the densification behavior of cryomilled copper powders during spark plasma sintering

Oxidation Behavior of Copper at a Temperature below 300 °C and the Methodology for Passivation

A manostat volumetric apparatus for studies on the kinetics of high-temperature reactions in solid-gas systems

Contact Info

Product

Resources

About