Optimized thermal properties in diamond particles reinforced copper-titanium matrix composites produced by gas pressure infiltration

Li, Jianwei; Zhang, Hailong; Wang, Lühua; Che, Zifan; Zhang, Yang; Wang, Jinguo; Kim, Moon J.; Wang, Xitao

doi:10.1016/j.compositesa.2016.10.005

Cited by 82 publications

(15 citation statements)

References 30 publications

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“…We previously showed that chromium (Cr) carbide nanostructures generated in an MWCNT–Cu composite can increase the interfacial bonding strength of MWCNT/Cu without deteriorating the thermal conductivity of the composite 22 . Alloying the metal matrix with elements such as Cr, Zr, and Ti offers a route to improve the interfacial thermal conductivity in the diamond–Cu composite 23 – 26 .…”

Section: Introductionmentioning

confidence: 99%

Chromium carbide/Carbon Nanotube Hybrid Structure Assisted Copper Composites with Low Temperature Coefficient of Resistance

Cho

Kikuchi

Lee

et al. 2017

Sci Rep

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In order to explore the possibility of using carbon nanotube (CNT) to introduce and control the temperature coefficient of resistance (TCR) of metal matrix composite, relatively thick and short multi-walled CNTs (MWCNTs) were introduced in the metal matrix with in-situ formation of chromium carbide (Cr7C3) at the CNT/copper (Cu) interface. We demonstrate that incompatible properties such as electrical conductivity and TCR can be achieved simultaneously by introducing MWCNTs in the Cu matrix, with control of the interfacial resistivity using the MWCNT/Cr7C3–Cu system. High electrical conductivity of 94.66 IACS and low TCR of 1,451 10–6 °C−1 are achieved in the 5 vol.% MWCNT–CuCr composite. In-situ formation of Cr7C3 nanostructures at the MWCNT/Cu interface by reaction of diffused Cr atoms and amorphous carbon of MWCNTs would assist in improving the electrical properties of the MWCNT–CuCr composites.

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Section: Introductionmentioning

confidence: 99%

Chromium carbide/Carbon Nanotube Hybrid Structure Assisted Copper Composites with Low Temperature Coefficient of Resistance

Cho

Kikuchi

Lee

et al. 2017

Sci Rep

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“…The measured values of the composites with increasing temperature are shown in Figure 7a. The ROM, Turner, and Kerner models are three original models for predicting composite CTE [10,12,14].…”

Section: Resultsmentioning

confidence: 99%

“…First, matrix alloying was employed, whereby active elements are added into the copper matrix to establish chemical interactions with diamond. Forming a thin nano- or micrometer-size carbide layer and adding minor amounts of active elements especially Zr [9,10], B [11], Ti [12,13], and Cr [14,15,16], can significantly optimize the interfacial combination. Apparently, the alloying elements inevitably diffuse into the copper matrix, which greatly reduces the TC of diamond-copper composites.…”

Section: Introductionmentioning

confidence: 99%

Improvement of ZrC/Zr Coating on the Interface Combination and Physical Properties of Diamond-Copper Composites Fabricated by Spark Plasma Sintering

Pan

Ren

et al. 2019

Materials

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In this study, diamond-copper composites were prepared with ZrC/Zr-coated diamond powders by spark plasma sintering. The magnetron sputtering technique was employed to coat the diamond particles with a zirconium layer. After heat treatment, most of the zirconium reacted with the surface of diamond and was transformed into zirconium carbide. The remaining zirconium on the zirconium carbide surface formed the outer layer. Owing to the method used to produce the ZrC/Zr-coated diamond in this study, the maximum thermal conductivity (TC) of 609 W·m−1·K−1 was obtained for 60 vol. % diamond-copper composites and the corresponding coefficient of thermal expansion (CTE) reached as low as 6.75 × 10−6 K−1. The bending strength of 40 vol. % ZrC/Zr-coated diamond-copper composites reached 255.95 MPa. The thermal and mechanical properties of ZrC/Zr-coated diamond-copper composites were substantially superior to those of uncoated diamond particles. Excellent properties can be attributed to the strengthening of the interfacial combination and the decrease in the interfacial thermal resistance due to the improvement associated with the ZrC/Zr coating. Theoretical analysis was also proposed to compare the thermal conductivities and CTE of diamond-copper composites fabricated with these two kinds of diamond powders.

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“…The Kerner model [30], which takes the shear effect into account at the boundary between reinforcement and matrix, has been widely used in the theoretical calculation of CTE of the composites [31]. The Kerner model can be expressed in Equation (1).…”

Section: Diamond Distribution Of Fgmsmentioning

confidence: 99%

Fabrication of Functionally Graded Diamond/Al Composites by Liquid–Solid Separation Technology

Zhou

Wang

et al. 2021

Materials

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The electronic packaging shell, the necessary material for hermetic packaging of large microelectronic device chips, is made by mechanical processing of a uniform block. However, the property variety requirements at different positions of the shell due to the performance have not been solved. An independently developed liquid–solid separation technology is applied to fabricate the diamond/Al composites with a graded distribution of diamond particles. The diamond content decreases along a gradient from the bottom of the shell, which houses the chips, to the top of the shell wall, which is welded with the cover plate. The bottom of the shell has a thermal conductivity (TC) of 169 W/mK, coefficient of thermal expansion (CTE) of 11.0 × 10−6/K, bending strength of 88 MPa, and diamond content of 48 vol.%. The top of the shell has a TC of 108 W/mK, CTE of 19.3 × 10−6/K, bending strength of 175 MPa, and diamond content of 15 vol.%, which solves the special requirements of different parts of the shell and helps to improve the thermal stability of packaging components. Moreover, the interfacial characteristics are also investigated. This work provides a promising approach for the preparation of packaging shells by near-net shape forming.

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Optimized thermal properties in diamond particles reinforced copper-titanium matrix composites produced by gas pressure infiltration

Cited by 82 publications

References 30 publications

Chromium carbide/Carbon Nanotube Hybrid Structure Assisted Copper Composites with Low Temperature Coefficient of Resistance

Chromium carbide/Carbon Nanotube Hybrid Structure Assisted Copper Composites with Low Temperature Coefficient of Resistance

Improvement of ZrC/Zr Coating on the Interface Combination and Physical Properties of Diamond-Copper Composites Fabricated by Spark Plasma Sintering

Fabrication of Functionally Graded Diamond/Al Composites by Liquid–Solid Separation Technology

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