2016
DOI: 10.1016/j.egypro.2016.07.129
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Optimization of Boron Diffusion for Screen Printed n-PERT Solar Cells

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Cited by 8 publications
(5 citation statements)
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“…The surface concentration (C S ) of boron increases from 3.8×10 19 atoms/cm 3 to 1.8×10 20 atoms/cm 3 when the depth is 0.15 μm, as figure 4 shows. This behavior of boron profile was also observed with diffusion using BBr 3 and performed in n-type silicon wafers and the sheet resistance was in the range of 60-70 Ω/, [33,34].…”
Section: Sheet Resistance and Doping Profilesupporting
confidence: 67%
“…The surface concentration (C S ) of boron increases from 3.8×10 19 atoms/cm 3 to 1.8×10 20 atoms/cm 3 when the depth is 0.15 μm, as figure 4 shows. This behavior of boron profile was also observed with diffusion using BBr 3 and performed in n-type silicon wafers and the sheet resistance was in the range of 60-70 Ω/, [33,34].…”
Section: Sheet Resistance and Doping Profilesupporting
confidence: 67%
“…Such p+ emitters are found in passivated emitter rear totally diffused (PERT) and tunnel oxide passivated contact (TOPCon) cells using n‐base silicon. Because of the lower solubility, 8 B‐formed p + emitters tend to be of lower concentration, ~10 19 cm −3 , than the P‐diffused n + emitters of conventional BSF and PERC, ~10 20 cm −3 9,10 . This potentially leads to comparatively greater sensitivity of the cell to changes in the charge density of states resulting from charge motion in the passivating antireflective coatings.…”
Section: Introductionmentioning
confidence: 99%
“…Because of the lower solubility, 8 B-formed p + emitters tend to be of lower concentration, $10 19 cm À3 , than the P-diffused n + emitters of conventional BSF and PERC, $10 20 cm À3 . 9,10 This potentially leads to comparatively greater sensitivity of the cell to changes in the charge density of states resulting from charge motion in the passivating antireflective coatings. Yamaguchi et al 11 found PID-p in p+/n fronts of PERT cell mini modules occurred on the order of a minute (À1,000 V applied to cell, 85 C, face grounded with Al).…”
Section: Introductionmentioning
confidence: 99%
“…2 Considering the manufacturing steps, the current PERC solar cell production lines are seen to be adaptable to the PERT solar cells due to the many similarities in the fabrication techniques, such as surface texturing, diffusion process, removal of the heavily doped rear surface, deposition of dielectric layers (ALD: Al 2 O 3 and PECVD: SiN x ), and metal screen printing. 5 PERT solar cells have already been extensively studied in the literature with various fabrication routes, particularly based on the doping method, such as diffusion furnace, 6,7 ion implantation, [8][9][10][11] atmospheric pressure chemical vapor deposition (APCVD), 12 plasma-enhanced chemical vapor deposition (PECVD), 13 spin-on doping, 14,15 or their use together. One of the challenges for the fabrication of PERT solar cells is the existence of the two doping steps for the rear and front surfaces, which necessitate protecting one side while doping the other at least once in the use of double-side doping methods such as furnace diffusion.…”
Section: Introductionmentioning
confidence: 99%