2016
DOI: 10.1109/tbcas.2014.2370794
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Optimal Design of Wireless Power Transmission Links for Millimeter-Sized Biomedical Implants

Abstract: This paper presents a design methodology for RF power transmission to millimeter-sized implantable biomedical devices. The optimal operating frequency and coil geometries are found such that power transfer efficiency (PTE) and tissue-loss-constrained allowed power are maximized. We define receiver power reception susceptibility (Rx-PRS) and transmitter figure of merit (Tx-FoM) such that their multiplication yields the PTE. Rx-PRS and Tx-FoM define the roles of the Rx and Tx in the PTE, respectively. First, the… Show more

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Cited by 208 publications
(105 citation statements)
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“…In biological tissues, the tradeoff between coil design and tissue losses results in an optimal frequency for wireless power transmission where efficiency is maximized. For example, the inductance of coils located on miniaturized, millimeter-scale implants ranges from 10 to 100 nH [66], [88], [146], [147]. To compensate for reduced magnetic flux through the miniaturized receiving coil, the carrier frequency for wireless power transfer should be increased, often into the hundreds of megahertz to single-digit gigahertz range [66], [146]- [149].…”
Section: A Poweringmentioning
confidence: 99%
“…In biological tissues, the tradeoff between coil design and tissue losses results in an optimal frequency for wireless power transmission where efficiency is maximized. For example, the inductance of coils located on miniaturized, millimeter-scale implants ranges from 10 to 100 nH [66], [88], [146], [147]. To compensate for reduced magnetic flux through the miniaturized receiving coil, the carrier frequency for wireless power transfer should be increased, often into the hundreds of megahertz to single-digit gigahertz range [66], [146]- [149].…”
Section: A Poweringmentioning
confidence: 99%
“…The coil is electrically connected to a T-shape PCB via the bondwires. Similar to the on-chip coil measurement, we used a deembedding technique [6] to remove parasitic effects from the bulky interconnects. The S-parameters of the short-circuited PCB with the bonding-wire and the open-circuited PCB were measured, converted to Z-parameters and Y-parameters, and subtracted from the coils Z-parameters and Y-parameters to eliminate the parasitic resistance/inductance and the parasitic capacitance, respectively.…”
Section: B Measurement Setupmentioning
confidence: 99%
“…2, 3-coil, etc.) [6]- [10]. For wireless power transmission to mm-scale IMDs, a 2 × 2.18 mm 2 integrated CMOS coil was reported in [7] providing good manufacturability, reliability, and cost competitiveness.…”
Section: Introductionmentioning
confidence: 99%
“…[3][4][5][6][7] The Q-factors of other coil shapes have also been investigated, for example, the planar Polygonal Spiral Coil (PSC). [8][9][10][11][12][13][14] Currently, most of the PSCs consist of one or two coil layers. The single-layer type is most common and its design has been optimized.…”
Section: Introductionmentioning
confidence: 99%
“…The single-layer type is most common and its design has been optimized. [8][9][10][11][12][13] However, when the size of the single-layer coil is fixed, it is often difficult to increase its inductance without significantly affecting the Q-factor because of the limitation in the diameter of the coil wire. The double-layer polygonal type is less constrained as discussed in Ref.…”
Section: Introductionmentioning
confidence: 99%