2007
DOI: 10.1088/0022-3727/40/20/s11
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Optical investigation methods for SiC device development: application to stacking faults diagnostic in active epitaxial layers

Abstract: We present a review of the different optical techniques that can be used to investigate the presence of as-grown and/or process-induced stacking faults (SFs) in 4H–SiC epitaxial layers. A SF is always a finite admixture of different polytypes, and we begin with a brief review of the systematic of SiC polytype structure and electronic properties. Next, we discuss the optical signature and compare with the results of several model calculations, taking successively into account the effect of valence band offset, … Show more

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Cited by 24 publications
(27 citation statements)
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“…52,53 As the damage level increases with the ion fluence, the stopping power along channeling directions quickly approaches the random stopping power. The small shift of damage profile of ϳ5% resulting from relatively lower stopping power of channeled He ions has been observed in slightly damaged SrTiO 3 . 54 Since this study mainly focuses on heavily damaged SiC samples, such channeling effects on the He stopping power will be ignored.…”
Section: He Stopping In Sicmentioning
confidence: 85%
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“…52,53 As the damage level increases with the ion fluence, the stopping power along channeling directions quickly approaches the random stopping power. The small shift of damage profile of ϳ5% resulting from relatively lower stopping power of channeled He ions has been observed in slightly damaged SrTiO 3 . 54 Since this study mainly focuses on heavily damaged SiC samples, such channeling effects on the He stopping power will be ignored.…”
Section: He Stopping In Sicmentioning
confidence: 85%
“…The irradiation conditions and experimental results are summarized in Table I. For each of the irradiation conditions, the damage profile in dpa and Au distribution are determined using SRIM 2008.01 full-cascade simulations 34 under the assumptions of a sample density of 3.21 g / cm 3 and threshold displacement energies of 35 and 20 eV for Si and C, respectively. 47 The SRIMpredicted damage profiles are overlaid on top of the corresponding TEM micrographs in Fig.…”
Section: Irradiations Of Au In Sicmentioning
confidence: 99%
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“…Currently there are 6H-SiC, 4H-SiC and 3C-SiC wafers commercially available. However, these wafers are still very expensive (Hobgood et al, 2004;Camassel & Juillaguet, 2007), so encouraging studies on crystalline and amorphous SiC films deposited on silicon or SOI (Silicon-On-Insulator) substrates using appropriate techniques. The use of SiC films besides being less expensive has another advantage which is the well known processing techniques for silicon micromachining.…”
Section: Introductionmentioning
confidence: 99%