One step synthesis of Ag nano-filler for e-ink and its low temperature metallization

Lee, Seung–Hyun; Choi, Donghyun; Piao, Hushan; Son, Younggon

doi:10.1016/j.mee.2016.06.014

Cited by 4 publications

(2 citation statements)

References 49 publications

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“…In the printing and electronic industries, pastes and inks are mainly produced using noble metals such as gold and silver, because they have low resistivity, low oxidation and high reliability [7][8][9][10]. However, their high cost limits their applications.…”

Section: Introductionmentioning

confidence: 99%

Preparation of Cu nanoparticles by a pulsed wire evaporation process for conductive ink applications

2019

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In the present study, Cu colloidal nanoparticles and nanopowders were successfully synthesized by a pulsed wire evaporation process. Cu-based nano-inks were prepared by mixing Cu nanoparticles with acrylic resin and solvent. Cu nanoparticles with a particle size of < 20 nm were uniformly dispersed in ethylene glycol. The Cu nanopowders were successfully coated with an organic solvent composed of a hydrocarbon compound. This organic coating effectively inhibited the oxidation of Cu nanopowders. In addition, the stability of dispersion of Cu nanoparticles in the inks was improved by a ball-milling process. The electrical conductivity of the prepared Cu nano-inks was 10-28 µS cm −1 for 20-40 wt% of Cu.

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Section: Introductionmentioning

confidence: 99%

Preparation of Cu nanoparticles by a pulsed wire evaporation process for conductive ink applications

2019

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“…A resistivity of 2.1 μΩ•m was finally obtained. Lee et al [25] prepared Ag NPs using a one-step synthesis process with direct ligand exchange. When the temperature used was above 240 °C, the electrical resistivity decreased to 0.03 μΩ•m.…”

Section: Introductionmentioning

confidence: 99%

The fabrication of highly conductive and flexible Ag patterning through baking Ag nanosphere−nanoplate hybrid ink at a low temperature of 100 °C

et al. 2018

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With the aim of developing highly conductive ink for flexible electronics on heat-sensitive substrates, Ag nanospheres and nanoplates were mixed to synthesize hybrid inks. Five kinds of hybrid ink and two types of pure ink were written to square shape on Epson photo paper using rollerball pens and sintered at a low temperature (100℃). The microstructure, electrical resistivity, surface porosity, hardness and flexibility of silver patterns were systematically investigated and compared. It was observed that the optimal mixing ratio of nanospheres and nanoplates was 1:1, which equipped the directly written pattern with excellent electrical and mechanical properties. The electrical resistivity was 0.103 μΩ·m, which was only 6.5 times of bulk silver. The enhancement compared to pure silver nanospheres or nanoplates based ink was owing to the combined action of nanospheres and nanoplates. It was a valued way to prepare Ag nanoink with good performance for printed/written electronics.

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Preparation and electrical conductivity of metal and photosensitive polymer composite film

Hsiao

Cheng

2019

Progress in Organic Coatings

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One step synthesis of Ag nano-filler for e-ink and its low temperature metallization

Cited by 4 publications

References 49 publications

Preparation of Cu nanoparticles by a pulsed wire evaporation process for conductive ink applications

Preparation of Cu nanoparticles by a pulsed wire evaporation process for conductive ink applications

The fabrication of highly conductive and flexible Ag patterning through baking Ag nanosphere−nanoplate hybrid ink at a low temperature of 100 °C

Preparation and electrical conductivity of metal and photosensitive polymer composite film

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