In deep sub-micron technologies, capacities of coupling between lines can reach values where one cannot ignore the amplitude of the noise due to this coupling. In this paper we highlight the impact of the use of various dielectric materials, to reduce the coupling capacitances, and we will study its impact on crosstalk reduction. From an analytic expression for crosstalk evaluation, one can predict that using a low-k dielectric equal to two one can reduce the crosstalk voltage by about 25%, which can be employed on a possible reduction of the space between lines.